We use cookies to distinguish you from other users and to provide you with a better experience on our websites. Close this message to accept cookies or find out how to manage your cookie settings.
We use cookies to distinguish you from other users and to provide you with a better experience on our websites. Close this message to accept cookies or find out how to manage your cookie settings.
High power RF device performance decreases as operation temperature increases (e.g. decreasing electron mobility affects cut-off frequencies and degrades device reliability). Therefore determination of device temperature is a key issue for device topology optimisation. In this work the temperature variation of AlGaN/GaN high-electron-mobility transistors grown either on silicon or sapphire substrate under bias operation was measured by micro Raman scattering spectroscopy. Temperature measurements up to power dissipation of 16 W for 4 mm development devices were carried out and a peak temperature of 650 K was determined. The difference of thermal resistance for similar devices grown on the two different substrates was assessed. The thermal resistances of different device topologies were compared to optimise the component design.
