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Novel MgO/SiO2 double protective layers to prevent Ag mirror degradation

Published online by Cambridge University Press:  17 June 2010

S.-J. Choi ,
K.-H. Kim ,
J.-H. Jo ,
S.-J. Kwon ,
S. Cho  and
H. Oh
S.-J. Choi
Affiliation:
Image Architecture Lab, Semiconductor R&D center, Samsung Electronics Co. Ltd., Yongin, 446-712, Republic of Korea
K.-H. Kim*
Affiliation:
AE group, Corporate Technology Operations SAIT, Samsung Electronics Co. Ltd., Yongin, 446-712, Republic of Korea
J.-H. Jo
Affiliation:
Advanced R&D group 3, Digital Printing Division, Samsung Electronics Co. Ltd., Suwon, 443-370, Republic of Korea
S.-J. Kwon
Affiliation:
Department of Material Science & Engineering, Pohang University of Science and Technology (POSTECH), Pohang, 790-784, Republic of Korea
S. Cho
Affiliation:
Department of Physics, College of Science and Technology, Yonsei University, Wonju, 220-710, Republic of Korea
H. Oh
Affiliation:
Image Architecture Lab, Semiconductor R&D center, Samsung Electronics Co. Ltd., Yongin, 446-712, Republic of Korea
*
kihong21.kim@samsung.com
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Abstract

We demonstrate a very stable silver-coated mirror exploiting novel MgO/SiO2 double layers. It was found that the MgO/SiO2 protective layer provides a good adhesion and protection to the silver surface. Using epoxy-Ti(40 nm)-Ag(60 nm)-MgO(5~10 nm)-SiO2(25 nm) mirror structures, we achieved over 95% reflectivity and observed a minimal degradation in reflectance even after severe environmental tests.

Type
Research Article
Information
The European Physical Journal - Applied Physics , Volume 51 , Issue 1 , July 2010 , 10501
Copyright
© EDP Sciences, 2010

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References

Park, S., Lee, H., Lee, K., Hwang, Y., J. Mater. Process. Technol. 187-188, 56 (2007) CrossRef
Chae, J., Park, S.S., Freiheit, T., Int. J. Mach. Tools Manuf. 46, 313 (2006) CrossRef
Liu, K., Li, X.P, Rahman, M., J. Mater. Process. Technol. 140, 352 (2003) CrossRef
Hass, G., Heaney, J.B., Herzig, H., Osantowski, J.F., Triolo, J.J., Appl. Opt. 14, 2639 (1975) CrossRef
Lubezky, I., Ceren, E., Klein, Z., Appl. Opt. 19, 1895 (1980) CrossRef
Fukuda, S., Kawamoto, S., Gotoh, Y., Thin Solid Films 442, 117 (2003) CrossRef
Wang, Zhenguo, Cai, Xun, Chen, Qiulong, Chu, P.K., Thin Solid Films 515, 3146 (2007) CrossRef
C.G. Shirley, S.C. Maston, in 28th Annual Proc. Int. Reliability Physics Symp., 1990, p. 72
Xilian, S., Jianda, S., Appl. Surf. Sci. 253, 2093 (2006) CrossRef
Heifets, E., Zhukovskii, Yu.F., Kotomin, E.A., Causa, M., Chem. Phys. Lett. 283, 395 (1998) CrossRef
D.L. Smith, Thin-Film Deposition (McGraw-Hill, Singapore, 1997)
Messier, R., Yehoda, J.E., J. Appl. Phys. 58, 3739 (1985) CrossRef