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Measurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrate

Published online by Cambridge University Press:  13 April 2011

A. M. Erer ,
E. Candan ,
M. H. Güven  and
Y. Turen
A. M. Erer
Affiliation:
Department of Physics, Karabuk University, 78200 Karabuk, Turkey
E. Candan*
Affiliation:
Department of Mechanical and Manufacturing Engineering, Bilecik University, Gulumbe Kampusu, 11210 Bilecik, Turkey
M. H. Güven
Affiliation:
Department of Physics, Zonguldak Karaelmas University, 67100 Zonguldak, Turkey
Y. Turen
Affiliation:
Department of Metals, Karabuk University, 78200 Karabuk, Turkey
*
ecandan@yahoo.com
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Abstract

The contact angle (Θ) of molten Sn and Sn-Ag alloys (0.5, 1.5, 3.5, 6 wt.% Ag) on Cu substrates have been studied by using sessile drop method at various temperatures (230, 250, 275 and 300 °C). Experimental results showed that additions of Ag to Sn resulted in a continuous decrease in the Θ up to 3.5 wt.% above which the Θ value was increased. Increasing alloy temperature also decreased the Θ proportionally. Experimental results revealed that a correlation between the Θ, alloy composition and the alloy temperature exists which yielded an empirical model to predict the Θ at a given Ag content and temperature for a given Sn-Ag alloy. The empirical model predicts the Θ reasonably well with the present work and the other published works.

Type
Research Article
Information
The European Physical Journal - Applied Physics , Volume 54 , Issue 1 , April 2011 , 11302
Copyright
© EDP Sciences, 2011

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