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Femtosecond laser machining and lamination for large-area flexible organic microfluidic chips

Published online by Cambridge University Press:  10 March 2009

C. Khan Malek ,
L. Robert  and
R. Salut
C. Khan Malek*
Affiliation:
Laboratoire FEMTO-ST/Dpt. MN2S, CNRS UMR 6174, 32 Av. de l'Observatoire, 25044 Besançon, France
L. Robert
Affiliation:
Laboratoire FEMTO-ST/Dpt. MN2S, CNRS UMR 6174, 32 Av. de l'Observatoire, 25044 Besançon, France
R. Salut
Affiliation:
Laboratoire FEMTO-ST/Dpt. MN2S, CNRS UMR 6174, 32 Av. de l'Observatoire, 25044 Besançon, France
*
chantal.khan-malek@femto-st.fr
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Abstract

A hybrid process compatible with reel-to-reel manufacturing is developed for ultra low-cost large-scale manufacture of disposable microfluidic chips. It combines ultra-short laser microstructuring and lamination technology. Microchannels in polyester foils were formed using focused, high-intensity femtosecond laser pulses. Lamination using a commercial SU8-epoxy resist layer was used to seal the microchannel layer and cover foil. This hybrid process also enables heterogeneous material structuration and integration.

Keywords

Type
Research Article
Information
The European Physical Journal - Applied Physics , Volume 46 , Issue 1: International Symposium on Flexible Organic Electronics (IS-FOE) , April 2009 , 12503
Copyright
© EDP Sciences, 2009

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