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A comparative study of the behaviour of silver, copper and nickel submitted to a constant high power flux density

Published online by Cambridge University Press:  19 May 2005

M. Abbaoui ,
A. Lefort ,
S. Clain  and
J. Rossignol
M. Abbaoui
Affiliation:
Laboratoire Arc Electrique et Plasmas Thermiques, CNRS UMR 6069, Université Blaise Pascal, 63177 Aubière, France
A. Lefort
Affiliation:
Laboratoire Arc Electrique et Plasmas Thermiques, CNRS UMR 6069, Université Blaise Pascal, 63177 Aubière, France
S. Clain
Affiliation:
Laboratoire de Mathématiques Appliquées, CNRS UMR 6620, Université Blaise Pascal, 63177 Aubière, France
J. Rossignol
Affiliation:
Laboratoire de Recherches sur la Réactivité des Solides, CNR UMR 5613, Université de Bourgogne, 21078 Dijon, France
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Abstract

In this paper, we present a numerical simulation of three metal cathode (silver, copper and nickel) submitted to a constant flux power flux density ranging between $1\times 10^{11}$ and $5\times 10^{12}~\rm W\,m^{-2}$. The goal is to compare the interface evolution (vaporization and liquefaction rate, appearance time of liquid and vapour, energetic repartition) to predict the behaviour of the cathodes during an electric arc.

Keywords

Type
Research Article
Information
The European Physical Journal - Applied Physics , Volume 31 , Issue 1 , July 2005 , pp. 45 - 51
Copyright
© EDP Sciences, 2005

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