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Young's Modulus and Fracture Strength of Three Polysilicons

  • W. N. Sharpe (a1), K. Jackson (a1), G. Coles (a1) and D. A. LaVan (a2)

Abstract

Polysilicon specimens from Cronos, Sandia, and Standard MEMS, Inc. were tested in tension. The specimens were nominally 6 or 20 μm wide and 250 or 1000 μm long. The Cronos and the Standard MEMS specimens had thicknesses of 1.5, 2.0, and 3.5 μm; whereas, the Sandia specimens were all 2.5 μm thick.

There was no dramatic difference in Young's modulus for the three materials. A total of 117 tests were run, and the average modulus for all three materials was 157 ± 9 GPa. However, the strengths were quite different: 1.56 ± 0.25 GPa for the Cronos material, 2.85 ± 0.40 GPa for Sandia's, and 2.04 ± 0.30 GPa for the SMI polysilicon.

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References

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