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Young's Modulus and Fracture Strength of Three Polysilicons

Published online by Cambridge University Press:  17 March 2011

W. N. Sharpe Jr. ,
K. Jackson ,
G. Coles  and
D. A. LaVan
W. N. Sharpe Jr.
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University, Baltimore, MD 21218
K. Jackson
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University, Baltimore, MD 21218
G. Coles
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University, Baltimore, MD 21218
D. A. LaVan
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185
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Abstract

Polysilicon specimens from Cronos, Sandia, and Standard MEMS, Inc. were tested in tension. The specimens were nominally 6 or 20 μm wide and 250 or 1000 μm long. The Cronos and the Standard MEMS specimens had thicknesses of 1.5, 2.0, and 3.5 μm; whereas, the Sandia specimens were all 2.5 μm thick.

There was no dramatic difference in Young's modulus for the three materials. A total of 117 tests were run, and the average modulus for all three materials was 157 ± 9 GPa. However, the strengths were quite different: 1.56 ± 0.25 GPa for the Cronos material, 2.85 ± 0.40 GPa for Sandia's, and 2.04 ± 0.30 GPa for the SMI polysilicon.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 657: Symposia EE – Materials Science of Microelectromechanical Systems (MEMS) Devices III , 2000 , EE5.5
Copyright
Copyright © Materials Research Society 2001

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References

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