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X-Ray Topographic Studies of Defects in PVT 6H-SiC Substrates and Epitaxial 6H-SiC Thin Films

Published online by Cambridge University Press:  21 February 2011

S. Wang
Affiliation:
Dept. of Materials Science & Engineering, SUNY, Stony Brook, NY 11794–2275
M. Dudley
Affiliation:
Dept. of Materials Science & Engineering, SUNY, Stony Brook, NY 11794–2275
C. H. Carter Jr
Affiliation:
Cree Research, Inc., 2810 Meridian Parkway, Durham, NC 27713.
H. S. Kong
Affiliation:
Cree Research, Inc., 2810 Meridian Parkway, Durham, NC 27713.
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Abstract

Synchrotron white beam X-ray topography has been used to characterize defect structures in (0001) 6H-SiC substrates grown by the sublimation physical vapor transport (PVT) technique as well as in 6H-SiC epitaxial thin films grown on these substrates. Defects revealed in 6H-SiC substrates include super screw dislocations and basal plane dislocations. It has been found that back-reflection topographs are particularly suitable for imaging such super screw dislocations as well as basal plane dislocations whenever transmission topography is not applicable. Epitaxial 6H-SiC thin films grown on such (0001) substrates (tilted a few degrees towards the a-axis) were also examined by using surface sensitive grazing Bragg-Laue topography. It has been shown that super screw dislocations were replicated in the epitaxial thin films but no basal plane dislocations were revealed in the thin films. Results from various topographic techniques are discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

[1] Ivanov, P.A. and Chelnokov, V.E., Semiconductor Science and Technology, 7, 863 (1992).Google Scholar
[2] Palmour, J.W., Edmond, J.A., Kong, H.S., and Carter, C.H. Jr, Physica B, 185, 461465 (1993).Google Scholar
[3] Ziegler, G., Lanig, P., Theis, D. and Weyrich, C., IEEE Trans. Electron. Devices ED- 30, 277 (1983).Google Scholar
[4] Hobgood, H.M., McHugh, J.P and Hopkins, R.H., presented at International Conference on SiC and Related Materials-1993, Wachington D.C., November 1993.Google Scholar
[5] Yang, J.W., Ph.D. Thesis, Case Western Reserve University (1993).Google Scholar
[6] Wang, S., Dudley, M., Carter, C. H. Jr., Asbury, D. and Fazi, C., in Applications of Synchrotron Radiation Techniques to Materials Science Perry, D.L., Shinn, N.D., Stockbauer, R.L., D'Amico, K.L., and Terminello, L.J. (Eds.), Mat. Res. Soc. Symp. Proc, 307, 249 (1993).Google Scholar
[7] Tuomi, T., Naukkarinen, K., and Rabe, P., Phys. Status Solidi, A 25, 93106 (1974).Google Scholar
[8] Hart, M., J. Appl. Crystallogr., 8, 436 (1975).Google Scholar
[9] Frank, F.C., Acta Cryst., 4, 497 (1951).Google Scholar
[10] Yao, G.-D., Dudley, M. and Wu, J., X-Ray Sci. Tech. 2, 195 (1990).Google Scholar
[11] Takahashi, J., Kanaya, M. and Fujiwara, Y., J. Cryst. Growth, 135, 6170 (1994).Google Scholar