Hostname: page-component-848d4c4894-2pzkn Total loading time: 0 Render date: 2024-05-13T03:52:43.899Z Has data issue: false hasContentIssue false
  • English
  • Français

X-ray Determination and Finite-Element Modeling of Stress in Passivated Al-0.5%Cu Lines During Thermal Cycling.

Published online by Cambridge University Press:  21 February 2011

Paul R. Besser ,
Anne Sauter Mack ,
David Fraser  and
John C. Bravman
Paul R. Besser
Affiliation:
Materials Science and Engineering Department, Stanford University, Stanford, CA 94305
Anne Sauter Mack
Affiliation:
Intel Corporation, 3065 Bowers Avenue, Santa Clara, CA 95051
David Fraser
Affiliation:
Intel Corporation, 3065 Bowers Avenue, Santa Clara, CA 95051
John C. Bravman
Affiliation:
Materials Science and Engineering Department, Stanford University, Stanford, CA 94305
Get access

Abstract

We have measured the principal strain state of AI-0.5%Cu lines passivated with silicon nitride directly and used it to calculate the stress state. The stress was determined as the lines were thermally cycled from room temperature to 450°C. The general stress-temperature behavior shows good fundamental agreement with that calculated using finite-element methods, although the magnitude of the stresses measured with x-rays is less than that predicted by modeling due to stressinduced voiding in the lines. This is shown with a high voltage scanning transmission electron microscope (STEM) operated in the backscattering mode.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 287
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Cullity, B.D.. Elements of X-ray Diffraction, Addison Wesley Publishing Co., Reading, MA (1978).Google Scholar
2. Segmuller, A. and Murakami, M.. Treat. on Mater. Sci. and Tech. 27 143, (1988).CrossRefGoogle Scholar
3. James, M.R. and Cohen, J.B., Treatise on Materials Sci. and Tech. 19A. 1, (1980).Google Scholar
4. Greenebaum, B., Sauter, A.I., Flinn, P.A., and Nix, W.D.. Appl. Phys. Lett. 58(17), 1845 (1991).CrossRefGoogle Scholar
5. Hinode, K., Asano, I., and Homma, Y.. IEEE Trans. Elec. Dev. 36(6), 1050 (1989).CrossRefGoogle Scholar
6. Yue, T., Funsten, W.P. and Taylor, R.V., IEEE Int. Rel. Phys. Symp. Proc., 142 (1985).Google Scholar
7. Besser, P.R., Sauter-Mack, A., Fraser, D.B., and Bravman, J.C., To be Published in the Journal of the Electrochemical Society (1993).Google Scholar
8. Flinn, P.A. and Chiang, C., J. Appl. Phys 67(6), 2927 (1990).CrossRefGoogle Scholar
9. Tezaki, A., Mineta, T., Egawa, H., and Noguchi, T., IEEE Int. Rel. Phys. Symp. Proc., 221 (1990).Google Scholar
10. Flinn, P.A.. MRS Symp. Proc. Vol. 188,3 (1990).CrossRefGoogle Scholar
11. Radler, M.J., Crowder, C.E., Shaffer, E.O., and Townsend, P.H.. MRS Symp. Proc.Vol. 264, (1992).CrossRefGoogle Scholar
12. Besser, P.R., Venkatraman, R., Brennan, S., and Bravman, J.C., MRS Symp. Proc.Vol. 239, 233 (1992).CrossRefGoogle Scholar
13. Besser, P.R., Brennan, S., and Bravman, J.C., Submitted to Journal of Materials Research, (1993).Google Scholar
14. ANSYS Eng. Analysis System, Swanson and Analysis Systems, Inc. 1990.Google Scholar
15. Sauter, A.I. and Nix, W.D.. IEEE Trans. on Comp., Hybrids and Manu. Tech 15(4), 594–600 (1992).CrossRefGoogle Scholar
16. Flinn, P.A. and Waychunas, G.A., J. Vac. Sci. Tech. B (6), 1749 (1988).CrossRefGoogle Scholar
17. Besser, P.R., Madden, M.C., and Flinn, P.A., J. Appl. Phys. 72(8), 3792 (1992).CrossRefGoogle Scholar
18. Madden, M. C., Abratowski, E.A., Marieb, T., and Flinn, P.A., MRS Symp. Proc. Vol. 265, 33 (1992).CrossRefGoogle Scholar
19. Besser, P.R. and Bravman, J.C., Proc. of 2nd Workshop on Stress-Induced Phenomena in Metall., To be published in Amer. Inst. Phys. Conf. Proc., (1993).Google Scholar
20. Besser, P.R., Marieb, T., and Bravman, J.C., Accepted to 1993 MRS Spring Conference Proc. (1993).Google Scholar