Hostname: page-component-76fb5796d-5g6vh Total loading time: 0 Render date: 2024-04-26T08:18:11.979Z Has data issue: false hasContentIssue false
  • English
  • Français

XPS and Electrochemical Studies on Tungsten-Oxidizer Interaction in Chemical Mechanical Polishing

Published online by Cambridge University Press:  10 February 2011

Dnyanesh Tamboli ,
Sudipta Seal  and
Vimal Desai
Dnyanesh Tamboli
Affiliation:
Advanced Materials Processing & Analysis Center (AMPAC) Mechanical, Materials &Aerospace Engineering Department University of Central Florida Orlando, FL 32816
Sudipta Seal
Affiliation:
Advanced Materials Processing & Analysis Center (AMPAC) Mechanical, Materials &Aerospace Engineering Department University of Central Florida Orlando, FL 32816
Vimal Desai
Affiliation:
Advanced Materials Processing & Analysis Center (AMPAC) Mechanical, Materials &Aerospace Engineering Department University of Central Florida Orlando, FL 32816
Get access

Abstract

Electrochemical interaction between the oxidizer and the metal is believed to play a key role in material removal in tungsten CMP. In this study, we use X-ray Photoelectron Spectroscopy (XPS) in conjunction with electrochemical measurements in both in-situ polishing conditions as well as in static solutions, to identify the passivation and dissolution modes of tungsten. Dissolution of tungsten oxides was found to be the primary non-mechanical tungsten removal mechanism in CMP.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 566: Symposium P – Chemical-Mechanical Poilshing-Fundamentals and Challenges , 1999 , 89
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Kaufman, F. B., Thompson, D. B., Broadie, R. E., Jaso, M. A., Gutherie, W. L., Pearson, D. J. and Small, M. B., j. Electrochem. Soc., 66 3460 (1991)10.1149/1.2085434Google Scholar
2. Streinz, C. C., Ligocki, D., Myres, T., Brusic, V., in “Chemical Mechanical Planarization”, eds. I., Ali and S., Raghavan, The Electrochemical Society Proceedings Vol. 96–22, Pub). The Electrochemical Society, NJ, 159 (1996).Google Scholar
3. Farkas, J., Caprio, R., Bajaj, R., Galanakis, C., Jairath, R., Jones, B. and Tzeng, S., in, “Advanced Metallization for ULSI Applications in 1994”, eds. R., Blumenthal and G., Janssen, publ. Materials Research Society, PA, 25 (1995).Google Scholar
4. Stein, D., Hetherington, D., Guilinger, T. and Cecchi, J., I. Electrochem. Soc., 145, 3190 (1998)10.1149/1.1838785Google Scholar
5. Kneer, E. A., Raghunath, C., Mathew, V., Raghavan, S. and Jeon, J. S., J. of Electrochem. Soc., 144, 3041 (1997).10.1149/1.1837956Google Scholar
6. Barr, T., Seal, S., J. Vac. Sci. Tech., A13, (1239).Google Scholar
7. Macdonald, D., Biaggio, S. and Song, H., J. Electrochem. Soc., 139, 170(1992)10.1149/1.2069165Google Scholar
8. Tamboli, D., Seal, S., Desai, V. and Maury, A., to be published, J. Vac. Sci. Tech. (accepted 1999)Google Scholar