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Use of Shock Waves to Measure Adhesion at Interfaces

Published online by Cambridge University Press:  15 February 2011

Gerald L. Nutt  and
Wayne E. King
Gerald L. Nutt
Affiliation:
Lawrence Livermore National Laboratory, 7000 East Avenue, P.O.Box 808, Livermore, CA. 94550
Wayne E. King
Affiliation:
Lawrence Livermore National Laboratory, 7000 East Avenue, P.O.Box 808, Livermore, CA. 94550
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Abstract

The central problem in the study of composite materials is the adhesive strength of the electronic bond between reinforcement and matrix. We have introduced a unique method of measuring the interface bond strength of a wide variety of engineering interfaces (e.g. metal/ceramic, semiconductor/metal, metal/polymer). Specimens are composed of a relatively thin overlayer on a thick substrate. The specimens are shocked using a magnetic hammer which accelerates a thin metal flyer onto the substrate. The shock, upon reflection at the free surface, is incident on the bonded interface as a tensile wave, spalling the overlayer. The method is unique in using free surface velocity measurements to determine the interface stress at the instant of separation. The debonding process is sufficiently rapid (on the order of 1.0 ns) that debonding occurs by the simultaneous breaking of atomic bonds, rather than by propagation of cracks nucleating at stress concentrations near existing flaws.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 273: Symposium Q – Intermetallic Matrix Composites II , 1992 , 331
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCES

[1] Snowden, W. E.. Mater. Sci Res., 14:651, (1981).Google Scholar
[2] Gupta, V., Argon, A. S., Parks, D. M., and Cornie, J. A.. J. Mech. Phys. Solids, to be published.Google Scholar
[3] Cornie, J. A., Argon, A. S., and Gupta, V.. MRS Bulletin, XVI(4):32–38, (1991).Google Scholar
[4] Gupta, V.. MRS Buletin, XVI(4):39–45, (1991).Google Scholar
[5] Gupta, V., Argon, A. S., Cornie, J. A.. and Parks, D. M.,” Mater. Sci. & Eng., A 126:105–117, (1990).CrossRefGoogle Scholar
[6] Nutt, Gerald L., Lai, William, Froeschner, Kenneth E., and King, Wayne E.. In Riihle, M., Evans, A. G., Ashby, M. F., and Hirth, J. P., editors, Metal - Ceramic Interfaces, pages 307–312, Acta-Scripta Metallugica, (1989).Google Scholar
[7] Nutt, Gerald L., Lai, William, Froeschner, Kenneth E., and King, Wayne E.. In DeKoven, B.M., Gellman, A.J., and Rosenberg, R., editors, Interfaces Between Polymers, Metals, and Ceramics, pages 385–390, Materials research Society Proceedings 153, 1989.Google Scholar
[8] Nutt, Gerald L.. Numerical model of bond strength measurements. In Bringans, R. D., Gibson, J. M., and Feenstra, R. M., editors, Atomic Scale Structure of Interfaces 159, pages 465–471, Materials Research Society Proceedings 159, (1990).CrossRefGoogle Scholar
[9] Nutt, Gerald L.. J. Mater. Res., 7(1):203–213, 1992.Google Scholar