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Uniformity, High Temperature Performance And Reliability Of X-Band Nitride Power Hemts Fabricated From 2-Inch Epitaxy

Published online by Cambridge University Press:  10 February 2011

R. Hickman
Affiliation:
SVT Associates, 7620 Executive Dr., Eden Prairie, MN 55344, rhickman@svta.com
J. M. Van Hove
Affiliation:
SVT Associates, 7620 Executive Dr., Eden Prairie, MN 55344, rhickman@svta.com
P. P. Chow
Affiliation:
SVT Associates, 7620 Executive Dr., Eden Prairie, MN 55344, rhickman@svta.com
J. J. Klaassen
Affiliation:
SVT Associates, 7620 Executive Dr., Eden Prairie, MN 55344, rhickman@svta.com
A. M. Wowchack
Affiliation:
SVT Associates, 7620 Executive Dr., Eden Prairie, MN 55344, rhickman@svta.com
C. J. Polley
Affiliation:
SVT Associates, 7620 Executive Dr., Eden Prairie, MN 55344, rhickman@svta.com
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Abstract

X-band performance, high temperature DC operation, and uniformity have been evaluated for 1 μm gate AlGaN/GaN HEMTs grown by RF atomic nitrogen plasma MBE. Deposition and fabrication were performed on 2-inch (0001) saphirre substrates to determine process uniformity. HEMTs with 300 μm total gate width and dual gate finger geometry have been fabricated with 650–700 cm2/V s mobility. Maximum frequency cut-offs on the order of of 8–10 were achieved. DC performance at room temperature was >500 mA/mm, and external transconductance was >70mS/mn. The transistors operated at test temperatures of 425°C.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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