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Ultrasonic Characterization of Thin Adhesive Bonds

Published online by Cambridge University Press:  21 February 2011

P. Dickstein ,
A. N. Sinclairw ,
E. Segal  and
Y. Segal
P. Dickstein
Affiliation:
Department of Mechanical Engineering, 5 King's College Road, Toronto, Canada M5S-1A4
A. N. Sinclairw
Affiliation:
Department of Mechanical Engineering, 5 King's College Road, Toronto, Canada M5S-1A4
E. Segal
Affiliation:
Department of Nuclear Engineering, Technion-Israel Institute of Technology, Haifa, Israel-32000
Y. Segal
Affiliation:
Department of Nuclear Engineering, Technion-Israel Institute of Technology, Haifa, Israel-32000
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Abstract

A series of nondestructive and destructive tests were performed on samples of aluminumto-aluminum bonded plates. The specimens featured a range nominal thickness of the adhesive layer from 0.0 up to 0.5 mm. It was found that a commercial bondtester was inappropriate for assessing the thickness of the adhesive in this range. However, the frequency peak of an ultrasonic echo signal from the adhesive layer was a reliable indicator of bond thickness. It is proposed that nondestructive assessments of the bond thickness could serve as an indicator of the longterm resistance of the adhesive to water ingress and bond degradation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 142: Symposium U – Nondestructive Monitoring of Materials Properties , 1988 , 349
Copyright
Copyright © Materials Research Society 1989

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