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Trapping of argon in ion beam deposited thin films of CNx Hy
Published online by Cambridge University Press: 01 February 2011
Abstract
Unbalanced magnetron sputtering deposition of CNx Hy films has been performed with various levels of negative substrate bias and with different flow rates of nitrogen and hydrogen. Argon was used as a sputtering gas and formed the majority of the gas in the plasma. The elemental concentrations of the films were measured in samples deposited on glassy carbon with a 2.2 MeV of He beam used to perform simultaneous RBS and ERS. Argon was found to be trapped in the non-hydrogenated films to a level of up to ∼ 4.6 %. The concentration of argon increased for the films deposited under higher negative bias. With the introduction of hydrogen, argon trapping was first minimized and later completely eliminated, even at higher bias conditions, suggesting that the softness of the films brought on by hydrogenation also caused the films to be unable to trap argon during growth and thus showing that argon stability is dependent on burial below a surface of particular structural properties.
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- Copyright © Materials Research Society 2004