Hostname: page-component-77c89778f8-gvh9x Total loading time: 0 Render date: 2024-07-17T12:27:33.507Z Has data issue: false hasContentIssue false
  • English
  • Français

Transgranular Slits in Aluminum Interconnects Caused by Thermal Stress and Electric Current

Published online by Cambridge University Press:  22 February 2011

W. Wang ,
Z. Suo  and
T.-H. Hao
W. Wang
Affiliation:
Mechanical Engineering Department, University of California, Santa Barbara, CA 93106
Z. Suo
Affiliation:
Mechanical Engineering Department, University of California, Santa Barbara, CA 93106
T.-H. Hao
Affiliation:
On leave from China Textile University, Shanghai 200051, P.R., China
Get access

Abstract

An aluminum interconnect can fail by a transgranular slit. We show how a rounded void collapses to such a slit, as atoms diffuse on the void surface, driven by electric current, thermal stress, and surface energy. We use a variational principle to simulate the shape evolution, and identify the critical conditions to trigger the shape instability.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 338: Symposium – Materials Reliability in Microelectronics IV , 1994 , 415
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Sanchez, J. E., McKnelly, L. T., and Morris, J. W., J. Appl. Phys. 72, 3201 (1992).Google Scholar
2. Rose, J. H., Appl. Phys. Lett. 61, 2170 (1992).Google Scholar
3. Joo, Y.-C. and Thompson, C. V., Mater. Res. Soc. Symp. Proc. 309, 351 (1993).Google Scholar
4. Kraft, O., Bader, S., Sanchez, J. E. and Arzt, E., Mater. Res. Symp. Proc. 309, 199 (1993).Google Scholar
5. Thompson, C.V. and Lloyd, J.R., MRS Bulletin, December Issue, p. 19 (1993).Google Scholar
6. Wohlbier, F.H., Diffusion and Defect Data—Solid State Data, Vol. 47 (Trans Tech Publications, Switzerland, 1986).Google Scholar
7. Gao, H., Mech, Q. J.. Appl. Math. 45, 149 (1992).Google Scholar
8. Suo, Z. and Wang, W., submitted to J. Appl. Phys. (1994).Google Scholar
9. Korhonen, M.A., unpublished work.Google Scholar
10. Ho, P.S., J. Appl. Phys. 41, 64 (1970).Google Scholar
11. Li, C.-Y., Borgesen, P., and Korhonen, M.A., Appl. Phys. Lett. 61, 411 (1992).Google Scholar
12. Suo, Z., Wang, W. and Yang, M., Appl. Phys. Lett. 64 (15) (1994).Google Scholar
13. Yang, W., Wang, W. and Suo, Z., J. Mech. Phys. Solids. (in press).Google Scholar
14. Marder, M., unpublished work.Google Scholar