Hostname: page-component-76fb5796d-dfsvx Total loading time: 0 Render date: 2024-04-26T14:49:31.950Z Has data issue: false hasContentIssue false

Trade-Offs For RAD-Hard Soi Structures

Published online by Cambridge University Press:  28 February 2011

G. E. Davis*
Affiliation:
Northrop Electronics Division, Hawthorne, CA 90250
Get access

Abstract

Total dose, dose rate, transient, single event upset and neutron radiation effects for dielectrically isolated MOS devices on S01(silicon-on-insulator) substrates are discussed. For large-scale, high-speed circuits, material, layout and process characteristics optimized for high circuit yield and reliability may conflict with improvements required to extend radiation thresholds. Some radiation hardening techniques applicable to silicon-on-insulator high speed thin film MOS devices are presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 1988

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Davis, G. E., Hughes, H. L., Kamins, T. I., IEEE Trans. Nucl. Sci., NS-29, 1685, 1982.CrossRefGoogle Scholar
2 Tsaur, B.-Y., Fan, J. C. C., Turner, W. and Silversmith, D. J., IEEE Trans. Electron Device Lett., EDL-3, 195, 1982.CrossRefGoogle Scholar
3 Tsaur, B.-Y., Mountain, R. W., Chen, C. K., Turner, C. W. and Fan, J. C. C., IEEE Electron Device Lett., EDL-5, 238, 1984.CrossRefGoogle Scholar
4 Mao, B.-Y., Chen, C.-E., Matloubian, M., Hite, L. R., Pollock, G., Hughes, H. L. and Maley, K., IEEE Trans. Nucl. Sci., NS-33, 1703, 1986.CrossRefGoogle Scholar
5 Leray, J.-L., IEEE Trans. Nucl. Sci., NS-32, 3921, 1985.CrossRefGoogle Scholar
6 Davis, G. E., Hite, L. R., Blake, T. G. W., Chen, C.-E., Lam, H. W. and DeMoyer, R. Jr., IEEE Trans. Nucl. Sci., NS-32, 4432, 1985.Google Scholar
7 Tsaur, B.-Y., Sferrino, V. J., Choi, H. K., Chen, C. K., Mountain, R. W., Schott, J. T., Shedd, W. M., LaPierre, D. C. and Blanchard, R., IEEE Trans. Nucl. Sci., NS-33, 372, 1986.CrossRefGoogle Scholar
8 Hite, L. R., Houston, T. W., Blake, T. G. W., Mei, P. C., Bailey, W. E., Chen, C-E., Mao, B.-Y., Matloubian, M. M., Pollack, G. P. and Sundarsen, R., To be published IEEE Trans. Nucl. Sci., NS-34, Dec. 1987.Google Scholar
9 Colinge, J.P., IEEE Electron Device Lett., EDL-7, 244, 1986.CrossRefGoogle Scholar
10 Mao, B.-Y., Chen, C.-E., Pollack, G., Hughes, H. L. and Davis, G. E., To be published IEEE Trans. Nucl. Sci., NS-34. Dec. 1987.CrossRefGoogle Scholar
11 Nakashima, S., Maeda, Y. and Akiya, M., IEEE Trans. Eelectron Devices, ED-33, 126, 1986.CrossRefGoogle Scholar
12 Tsao, S. S., Fleetwook, D. M., Weaver, H. T., Pheiffer, L. and Cellar, G. K., To be published IEEE Trans. Nucl. Sci., NS-34, Dec. 1987.CrossRefGoogle Scholar
13 Ohno, T., Izumi, K., Shimaya, M. and Shiono, N., Electronic Letters, 23, 141, 1987.CrossRefGoogle Scholar