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Torsion Testing Of Diffusion Bonded Liga Formed Nickel

Published online by Cambridge University Press:  10 February 2011

T. R. Christenson ,
T. E. Buchheit  and
D. T. Schmale
T. R. Christenson
Affiliation:
Sandia National Laboratories, PO Box 5800, MS-0329, Albuquerque, NM 87185
T. E. Buchheit
Affiliation:
Sandia National Laboratories, PO Box 5800, MS-0329, Albuquerque, NM 87185
D. T. Schmale
Affiliation:
Sandia National Laboratories, PO Box 5800, MS-0329, Albuquerque, NM 87185
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Abstract

A test technique has been devised which is suitable for the testing of the bond strength of batch diffusion bonded LIGA or DXRL defined structures. The method uses a torsion tester constructed with the aid of LIGA fabrication and distributed torsion specimens which also make use of the high aspect ratio nature of DXRL based processing. Measurements reveal achieved bond stengths of 130 MPa between electroplated nickel with a bond temperature of 450°C at 7 ksi pressure which is a sufficiently low temperature to avoid mechanical strength degradation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 546: Symposium AA – Materials Science of Microelectromechanical Systems (MEMS)… , 1998 , 127
Copyright
Copyright © Materials Research Society 1999

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References

1. Klaassen, E. H., Petersen, K., Noworolski, J. M., Logan, J., Maluf, N. I., Brown, J., Storment, C., McCulley, W., and Kovacs, G. T. A., in Tech. Digest Transducers '95, Stockholm, pp. 556–559, (1995).Google Scholar
2. Guckel, H., Proc. of the IEEE, 86 (8), 1586–1593, (1998).Google Scholar
3. Becker, E. W., Ehrfeld, W., Hagman, P., Maner, A., and Münchmeyer, D., Microelectronic Eng. 4, 35–56, (1986).Google Scholar
4. Christenson, T. R., Guckel, H., in Proc. of SPIE Micromachining and Microfabrication Process Technology, 2639, 134–145, (1995).Google Scholar
5. Guckel, H., Mangat, P. S., Emmerich, H., Massoud-Ansari, S., Klein, J., Earles, T., Zook, J. D., Ohnstein, T., Johnson, E. D., Siddons, D. P., Christenson, T. R., in Tech. Digest 1996 Solid-State Sensor and Actuator Workshop, Hilton head, SC, 60–63, (1996).Google Scholar
6. Christenson, T. R., Schmale, D. T., to be published in Proc. of MEMS '99, Orlando, FL, (1999).Google Scholar
7. Walker, P. and Tam, W. H., Eds., Handbook of Metal Etchants, (CRC Press, Boca Raton, FL, 1991), p. 874.Google Scholar
8. Christenson, T. R., Buchheit, T. E., Schmale, D. T., and Bourcier, R. J., in Microelectromechanical Structures for Materials Research, (Mater. Res. Proc., 518, San Francisco, CA, 1998) to be pub.Google Scholar