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Three-Dimensional Finite Element Simulation of Electro and Stress Migration Effects in Interconnect Lines

Published online by Cambridge University Press:  10 February 2011

Sven Rzepka ,
Matt A. Korhonen ,
Eicke R. Weber  and
Che-Yu Li
Sven Rzepka
Affiliation:
Dept. MSE, Cornell University, Ithaca, NY 14853–1501; ScR13@Cornell.edu
Matt A. Korhonen
Affiliation:
Dept. MSE, Cornell University, Ithaca, NY 14853–1501; ScR13@Cornell.edu
Eicke R. Weber
Affiliation:
Dept. MSE, Cornell University, Ithaca, NY 14853–1501; ScR13@Cornell.edu
Che-Yu Li
Affiliation:
Dept. MSE, Cornell University, Ithaca, NY 14853–1501; ScR13@Cornell.edu
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Abstract

A tool for 3-D modeling of EM and SM in interconnect lines has been developed based on a commercial finite element code. After detailing the approach, we focus on the verification of the simulator by comparing the results of 1-D analytic and FEM simulations, and then we apply the simulator to interconnect line segments with a specified grain structure.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 473: Symposium J – Materials Reliability in Microelectronics VII , 1997 , 329
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

[1] Weide, K. and Hasse, W., 1992 IEEE/IRPS, vol. 30, 361 (1992)Google Scholar
[2] ANSYS® user's manual, vol. 1, Procedures, chapter 8.1.4, page 8/11–13; SAS IP, August 31, 1995 Google Scholar
[3] Korhonen, M.A., Borgesen, P., Tu, K.N., and Li, C.-Y., J. Appl. Phys., vol. 73, 3790 (1993)Google Scholar
[4] Filippi, R.G., Wachnik, R.A., Aochi, H., Lloyd, J.R., and Korhonen, M.A., Appl. Phys. Lett., 69, 2350 (1996)Google Scholar
[5] Herring, C., J. Appl. Phys., Vol. 21, 427 (1950)Google Scholar
[6] Scherge, Bauer, and Mullins, : Acta Metal. Mater., vol. 43, 3525 (1995)Google Scholar