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Thin Film Wiring for Integrated Electronic Packages

Published online by Cambridge University Press:  21 February 2011

Sheree H. Wen  and
Jungihl I. Kim
Sheree H. Wen
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Height, NY 10598
Jungihl I. Kim
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Height, NY 10598
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Abstract

Among the available packaging technologies, thin film wiring is most suitable for high density package applications. This paper discusses the materials choices for the thin film wiring and some possible fabrication processes. The Cu- polymer or Cu- glass system are most promising from both performance and manufacturability perspectives. The interface adhesion and high inter layer interconnection resistance are critical problems for this structure. The use of a Cr, Cu blend structure as an interface layer will solve this problem. The microstructure, interface chemistry and the adhesion mechanisms of this blend layer are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 81
Copyright
Copyright © Materials Research Society 1988

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References

REFERENCES

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