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Thin Diamond Films for Tribological Applications

Published online by Cambridge University Press:  28 February 2011

M.S. Wong
Affiliation:
Dept of Materials Science and Engineering, Northwestern University, Evanston, IL 60208
R. Meilunas
Affiliation:
Dept of Materials Science and Engineering, Northwestern University, Evanston, IL 60208
T.P. Ong
Affiliation:
Dept of Materials Science and Engineering, Northwestern University, Evanston, IL 60208
R.P.H. Chang
Affiliation:
Dept of Materials Science and Engineering, Northwestern University, Evanston, IL 60208
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Abstract

Diamond films have been deposited on Si, Mo and many other substrates by microwave and radio frequency plasma enhanced chemical vapor deposition. Although the adhesion between the diamond film and most of the metal substrates is poor due to residual thermal stress from the mismatch of thermal expansion coefficients, we have developed processes to promote the growth of uniform and continuous diamond films with enhanced adhesion to metal substratesfor tribological applications. The tribological properties of these films are measured using a ring-on-block tribotester. The coefficients of friction of diamond films sliding against a 52100 steel ring under the same experimental conditions are found to be significantly different depending on the morphology, grain size and roughness of the diamond films. However, under all cases tested, it is found that for uniform and continuous diamond films with small grain size of 1-3 micrometers, the coefficient of friction of thediamond film sliding against a steel ring under lubrication of a jet of mineral oil is about 0.04.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

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