Hostname: page-component-7bb8b95d7b-495rp Total loading time: 0 Render date: 2024-09-12T07:14:30.806Z Has data issue: false hasContentIssue false

Thin CuInS2 Films Prepared by MOMBE: Interface and Surface Properties

Published online by Cambridge University Press:  01 February 2011

C. Pettenkofer
Affiliation:
Hahn-Meitner-Institut SE6 Glienickerstr100 D-14109 Berlin
C. Lehmann
Affiliation:
Hahn-Meitner-Institut SE6 Glienickerstr100 D-14109 Berlin
W. Calvet
Affiliation:
Hahn-Meitner-Institut SE6 Glienickerstr100 D-14109 Berlin
Get access

Abstract

CuInS2 films were prepared on Si(111) by MOMBE using standard MBE Cu and In sources and Ditertbutyldisulfide (TBDS) as an organic sulfur precursor. The films were analyzed in situ by XPS, LEED and UPS. Deposition at 250°C yields chalcopyrite films [1] with admixtures of CuSi2 and CuIn alloys. Deposition at higher temperatures up to 550°C was used to clarify the feasibility of the process. High quality LEED diffraction patterns show epitaxial growth but CuSi2 precipitations are still observed for deposition on Si(111). A buffer layer of indiumsulfide showed no considerable effect on the interface morphology. The obtained LEED pattern are in accordance with the epitaxial relation Si{111}||CuInS2{112}. Even for temperatures as high as 550°C no incorporation of Carbon or residual hydrocarbons in the film or adsorbed at the surface were detected.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Calvet, W., Lehmann, C., Plake, T., Pettenkofer, C., Thin Solid Films 2005, in pressGoogle Scholar
2 Hunger, R., Scheer, R., Diesner, K., Su, D.S., Lewerenz, H.J., Appl. Phys. Lett. 69, 1996, 3010 Google Scholar
3 Calvet, W., Lewerenz, H.J., Pettenkofer, C., Thin Solid Films, 431-432, 2003, 317 Google Scholar
4 Calvet, W., Pettenkofer, C., Lewerenz, H.J., j. Vac. Sci. Technol. B21, 2003, 1335 Google Scholar