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Thermochemistry and Electrical Contact Behavior of Electrode-Thermistor Interfaces

Published online by Cambridge University Press:  10 February 2011

David P. Cann
Affiliation:
Center for Dielectric Studies, Materials Research Laboratory, The Pennsylvania State University, University Park, PA 16802
Clive A. Randall
Affiliation:
Center for Dielectric Studies, Materials Research Laboratory, The Pennsylvania State University, University Park, PA 16802
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Abstract

The electronic structure of electrode-thermistor interfaces will be related to the thermochemical properties of the interface. Sessile drop wetting experiments of metallic electrodes on commercial BaTiO3 PTCR ceramic devices in combination with measurements of the electrical contact properties of the interface through impedance spectroscopy measurements will be used to establish a fundamental perspective of the electrode-ceramic interface. It will be shown that the thermodynamic work of adhesion (Wad), which is the sum of the strengths of chemical interactions present at the interface, can be manipulated by the addition of chemically active elements to the electrode metal which can segregate to the interface and enhance adhesion. This same procedure will be used to modify the important electrical interfacial properties such as the contact resistance and capacitance.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

1. Kurtin, S., McGill, T.C., and Mead, C. A., Phys. Rev. Lett. 22, 1433 (1969).Google Scholar
2. Rhoderick, E.H. and Williams, R.H., Metal-Semiconductor Contacts (Clarendon Press, Oxford, England, 1988).Google Scholar
3. Brillson, L.J., Surf. Sci. Rep. 2, 123 (1982).Google Scholar
4. Louie, S.G., Chelikowsky, J.R., and Cohen, M.L., Phys. Rev. B 15, 2154 (1982).Google Scholar
5. Ruhle, M. and Evans, A.G., Mat. Sci. Eng. A107, 187 (1989).Google Scholar
6. Cann, D. P. and Randall, C. A., to appear in Mater, J.. Res.Google Scholar
7. Chatain, D., Coudurier, L., and Eustathopolous, N., Rev. Phys. Appl. 23, 1055 (1988).Google Scholar
8. de Boer, F.R., Boom, R., Martens, W.C.M., Miedema, A.R., and Niessen, A.K., Cohesion in Metals (North Holland, New York, NY, 1988).Google Scholar
9. Li, J.G., Coudurier, L., and Eustathopolous, N., J. Mater. Sci. 24, 1109 (1989).Google Scholar
10. Basu, H.S. and Maiti, R.N., Mat. Res. Bull. 21, 1107 (1986).Google Scholar
11. Cann, D.P. and Randall, C.A., J. Appl. Phys. 80, 1628 (1996).Google Scholar
12. Naidich, Ju. V., Prog, in Surf. Memb. Sci. 14, 353 (1981).Google Scholar
13. Miedema, A.R., Z. Metallkde. 69, 455 (1978).Google Scholar