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The Thermal Stability of a TiAl Based Alloy

Published online by Cambridge University Press:  22 February 2011

C. Jin ,
W. Chen ,
J. Wang  and
X. Wan
C. Jin
Affiliation:
Institute of Materials, Shanghai University Shanghai, 200072, P.R.C.
W. Chen
Affiliation:
Institute of Materials, Shanghai University Shanghai, 200072, P.R.C.
J. Wang
Affiliation:
Institute of Materials, Shanghai University Shanghai, 200072, P.R.C.
X. Wan
Affiliation:
Institute of Materials, Shanghai University Shanghai, 200072, P.R.C.
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Abstract

The thermal stability of a TiAl based alloy was investigated through a series of high temperature exposures in air and vacuum. The microstructures were found to be thermally stable. The bending tests showed that both ductility and strength of air-exposed specimens decreased, but no significant variation was observed in those exposed in vacuum. The influence of alloy microstructure, thermal exposure temperature and time was also taken into account here.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 364: Symposium L – High-Temperature Ordered Intermetallic Alloys–VI , 1994 , 1023
Copyright
Copyright © Materials Research Society 1995

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