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Thermal Expansion and Relaxation of W-Cu Multilayers

Published online by Cambridge University Press:  25 February 2011

Wen-C. Chiang ,
Soo-Kil Kim  and
David V. Baxter
Wen-C. Chiang
Affiliation:
Dept. of Physics, Indiana University, Bloomington, IN 47405
Soo-Kil Kim
Affiliation:
Permanent Address: Dept. of Premedical Sciences, Kosin Medical College, Busan, Korea
David V. Baxter
Affiliation:
Dept. of Physics, Indiana University, Bloomington, IN 47405
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Abstract

We have studied the structure of W-Cu multilayers with modulation wavelengths between 65 and 110 xsÅ over the temperature range 25-400° C. Using a high temperature diffractometer stage specifically designed for low angle work, thermal expansion coefficients were measured and found to be marginally greater than would be expected from bulk behavior even when interaction with the substrate is taken into account. Upon annealing at temperature as low as 180° C, increased intensity of the low angle superlattice peaks is observed. Heat treatments above 180° C result in an irreversible change in the multilayer associated with the migration of Cu atoms to cracks produced by thermally induced stresses.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 286: Symposium J – Nanophase and Nanocomposite Materials , 1992 , 367
Copyright
Copyright © Materials Research Society 1993

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References

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