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Texture Formation and Improvement of Grain Boundary Weak‐Links in Tape Shaped Wire Prepared by the Unidirectional Solidification Technique.

Published online by Cambridge University Press:  28 February 2011

Michiya Okada
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Toyotaka Yuasa
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Tosimi Matsumoto
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Katuzo Aihara
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Masahiro Seido
Affiliation:
Metal Research Laboratory, Hitachi Cable Ltd., Tsuchiura, Ibaraki 300.
Sinpei Matsuda.
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
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Abstract

Au‐Sheathed Y‐Ba‐Cu‐O(YBCO) and Tl‐Ba/Sr‐Ca‐Cu‐O(TBSCCO) tapes were fabricated by the drawing‐rolling and subsequent unidirectional solidification. A typical microstructure of melt‐textured polycrystallite including fine particles of second phase(e.q. Y‐211) was observed. The Tl‐2223 tapes prepared at an optimized condition yielded Jc=15,300 A/cm2 at 77K in the absence of magnetic field, and l,100A/cm2 in a magnetic field of IT. The enhancement of Jc in a magnetic field is suggested to be due to the improvement of weak‐links in grain boundaries.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

1 Matsuda, S., Okada, M., Morimoto, T., Matsumoto, T. and Aihara:, K. High‐Temperature Superconductors, ed. Brodsky, M. B., Dynes, R. C., Kitazawa, K. and Tuller, H. L. (MRS, Pittsburgh, 1988)p695.Google Scholar
2 Okada, M., Okayama, A., Morimoto, T., Matsumoto, T., Aihara, K. and Matsuda:, S. Jpn. J. AppL Phys. 27(1988)L185.Google Scholar
3 Matsumoto, T., Okada, M., Okayama, A., Morimoto, T., Aihara, K., and Matsuda:, S. World Congress on Superconductivity, ed. Burnham, C. G. and Kane, R.(World Scientific Pub., Singapole, 1988) p321.Google Scholar
4 Okada, M., Nishiwaki, R., Kamo, T., Matsumoto, T., Aihara, K., Matsuda, S., and Seido:, M. Jpn. J. AppL Phys. 27(1988)L2345.Google Scholar
5 Matsumoto, T., Okada, M., Nishiwaki, R., Kamo, T., Aihara, K., Matsuda, S., Seido, M., Ozawa, K., Morii, Y. and Funahashi:, S. ISTEC WORKSHOP ON SUPERCONDUCTIVITY. Oiso. Feb. 13. 1989. (ISTEC, 1989) pill.Google Scholar
6 Yamada, Y., Fukushima, N., Nakayama, S., Yoshino, H. and Murase:, S. Jpn. J. AppL Phys. 26(1987)L865.Google Scholar
7 Jin, S., Sherwood, R. C., Van Dover, R. B., Tiefel, T. H. and Jornson, D. W. Jr: AppL Phys. Lett. 51(1987)203.Google Scholar
8 Murakami, M., Matsuda, S., Sawano, K., Miyamoto, K., Hayasi, A., Morita, M., Doi, K., Teshima, H., Sugiyama, M., Kimura, M., Fujinami, M., Saga, M., Matsuo, M., and Hamada:, H. Advances in Superconductivity. (Springer‐Verlag, 1988), p247.Google Scholar
9 Chaudhari, P., Mannhart, J., Dimos, D., Tsuei, C. C., Chi, J., Oprysko, M. M. and Scheuermann:, M. Phys. Rev. Lett. 60(1988)1653.Google Scholar
10 Dimos, D., Chaudhari, P., Manhart, J. and LeGoues:, F. K. Phys. Rev. Lett. 61(1988)219.Google Scholar
11 Bean:, C. P. Phys. Rev. Lett. 8(1962)250.Google Scholar
12 Soeta, A., Suzuki, T., Takeuchi, S., Kamo, T., Matsuda:, S. Proc. 2nd INTERNATIONAL CONFERENCE ON SUPERCONDUCTIVITY. (ISTEC, 1989) (to be published)Google Scholar