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Tensile Test of Bulk- and Surface-Micromachined 0.1-νm Thick Silicon Film using Electrostatic Force Grip System

Published online by Cambridge University Press:  15 March 2011

Toshiyuki Tsuchiya ,
Jiro Sakata ,
M. Shikida  and
K. Sato
Toshiyuki Tsuchiya
Affiliation:
Toyota Central Research and Development Laboratories, Inc., Nagakute Aichi 480-1192, Japan Department of Microsystem Engineering, Nagoya University, Chikusa, Nagoya Aichi 464-8603, Japan
Jiro Sakata
Affiliation:
Toyota Central Research and Development Laboratories, Inc., Nagakute Aichi 480-1192, Japan
M. Shikida
Affiliation:
Department of Microsystem Engineering, Nagoya University, Chikusa, Nagoya Aichi 464-8603, Japan
K. Sato
Affiliation:
Department of Microsystem Engineering, Nagoya University, Chikusa, Nagoya Aichi 464-8603, Japan
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Abstract

Single-crystal silicon films of sub-micrometer thicknesses were tensile tested using a thin film tensile tester with an electrostatic force grip. The tester has been newly designed for this thin film. It uses a servo-controlled balance for small-force measurement with a resolution of less than 100 νN. The specimens were fabricated using bulk- and surface-micromachining starting with a SIMOX wafer, and an epi-SOI wafer. The bulk micromachined specimens were released from a wafer by anisotropic etching from the backside of the wafer. The specimen size was 0 to 500 νm long, 20 or 50 νm wide and 0.14 νm thick. The thinner specimens were fabricated by surface micromachining and dry release process using XeF2 and vapor HF etching to avoid stiction of the specimens. The size was 0 to 600 νm long, 1 to 20 νm wide and 0.05 νm thick. These wafers were (100) oriented and the loading axis of the specimen was <110>. The tensile strength of the bulk micromachined specimens ranged from 1.4 to 4.8 GPa for twelve samples and that of the surface micromachined specimens ranged from 1.0 to 6.8 GPa for seven samples.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 687: Symposium B – Materials Science of Microelectromechanical Systems (MEMS) Devices IV , 2001 , B5.45
Copyright
Copyright © Materials Research Society 2002

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