Boron doping, using an elemental boron source during molecular beam epitaxial growth of silicon, has been studied. The boron flux was provided by a high temperature source heated by radiation and electron bombardment. The maximum boron deposition rate used was 1×1012 cm−2 s−1 at an estimated B temperature of 1950 °C. For growth at a substrate temperature of 650 °C, there is very little surface segregation when the doping level is in the range 1×1016-1×1019 cm−3. For very high boron to silicon flux ratio (>7×10−3) there is a strong surface segregation that results in surface accumulation of boron. This initially leads to a 2×2 reconstruction of the Si (100) surface, and further surface segregation during growth results in roughening of the surface due to the creation of (311)-facets. In a separate set of experiments, the surface segregation was studied using in situ Auger electron spectroscopy of predeposited layers of boron that were gradually covered by Si capping layers. Strong and surface coverage dependent surface segregation was observed both in the case of Si (100) and (111) substrates.