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Surface Flatness and Interface Stability of Ni-P Film using New Electroless Plating Method with the Emulsion of Supercritical CO2

  • Hiroki Uchiyama (a1), Masato Sone (a2), Chiemi Ishiyama (a3) and Yakichi Higo (a4)

Abstract

This paper proposes a novel coating method combining supercritical fluid technology and electroless plating in a hybrid technique. The electroless plating reactions are carried out in an emulsion of supercritical carbon dioxide (sc-CO2) and an electroless plating solution with surfactants. The Ni-P film obtained by this proposed technique was a uniform and conformal film without the pinholes and nodules. The Ni-P film fabricated by our technique was smoother and more uniform than the substrate after pretreatment and the conventional electroless plating.

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Keywords

Surface Flatness and Interface Stability of Ni-P Film using New Electroless Plating Method with the Emulsion of Supercritical CO2

  • Hiroki Uchiyama (a1), Masato Sone (a2), Chiemi Ishiyama (a3) and Yakichi Higo (a4)

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