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Surface Chemical Characteristics of CMP Polyurethane Pads

Published online by Cambridge University Press:  01 February 2011

Hongqi Xiang ,
Abaneshwar Prasad  and
Edward E. Remsen
Hongqi Xiang
Affiliation:
hongqi_xiang@cabotcmp.com, Cabot Microelectronics Corporation, R & D Enabling, 870 N. Commons Drive, Aurora, IL, 60504, United States, (630) 375-5487, (630) 375-2082
Abaneshwar Prasad
Affiliation:
Abaneshwar_Prasad@cabotcmp.com, Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, IL, 60504, United States
Edward E. Remsen
Affiliation:
Edward_Remsen@Cabotcmp.com, Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, IL, 60504, United States
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Abstract

Attenuated total reflection FT-IR spectroscopy coupled with a hydrogen-deuterium exchange technique is employed to investigate the surface chemistry of two polishing pads, a thermoplastic polyurethane (TPU) pad and a commercial cast urethane (PU) pad. A time/temperature-dependent reduction of nitrogen-hydrogen stretching modes (νN-H) was observed when the pads were immersed in deuterium oxide (D2O). Compared to TPU pads, the PU pads showed an ambiguous correlation between dependence of the band intensity changes and D2O-immersion time/temperature. For both types of pads, a sharp decrease in νN-H band intensity and an unexpected rebound in νN-H band intensity were observed within 24 hrs after immersing the pads in D2O. However, a comparable rebound in νN-H band intensity was not observed for conditioned TPU pad samples. This phenomenon is proposed to be due to a rearrangement of polar groups at the pad surface when the pad is immersed in water, which may influence pad performance on the asperity level.

Keywords

CMPsurface chemistrydiffusion
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 991: Symposium C – Advances and Challenges in Chemical Mechanical Planarization , 2007 , 0991-C01-03
Copyright
Copyright © Materials Research Society 2007

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References

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11Epic® is a registered trademark of Cabot Microelectronics Corporation.Google Scholar