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Submicron Ferroelectric Elements Fabricated by Direct Electron Beam Lithography

  • Dong-Joo Kim (a1), Jin Seo Im (a1) (a2), Carol Thompson (a1) (a3), S. K. Streiffer (a1), G. Wiederrecht (a2) and O. Auciello (a1)...

Abstract

To realize Gigabit density ferroelectric memory devices, downscaling issues involving processing, materials, and fundamental ferroelectric behavior must be resolved. To address patterning and characterizing ferroelectric films at the nanoscale, we have prepared different lateral sizes of ferroelectric PZT capacitors down to 120 nm, using direct-write electron beam lithography. Characterization of the piezoelectric activity of the patterned elements was performed by means of piezoelectric-sensitive scanning probe microscope in the contact mode. Switching of single 120 nm cells was achieved.

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Submicron Ferroelectric Elements Fabricated by Direct Electron Beam Lithography

  • Dong-Joo Kim (a1), Jin Seo Im (a1) (a2), Carol Thompson (a1) (a3), S. K. Streiffer (a1), G. Wiederrecht (a2) and O. Auciello (a1)...

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