Hostname: page-component-8448b6f56d-cfpbc Total loading time: 0 Render date: 2024-04-25T00:47:31.221Z Has data issue: false hasContentIssue false
  • English
  • Français

Sub-Half Micron Electroless Cu Metallization

Published online by Cambridge University Press:  15 February 2011

V. M. Dubin ,
Y. Shacham-Diamand ,
B. Zhao ,
P. K. Vasudev  and
C. H. Ting
V. M. Dubin
Affiliation:
School of Electrical Engineering and the National Nanofabrication Facility, Comell University, Ithaca, NY 14853
Y. Shacham-Diamand
Affiliation:
School of Electrical Engineering and the National Nanofabrication Facility, Comell University, Ithaca, NY 14853
B. Zhao
Affiliation:
SEMATECH, 2706 Montopolis Drive, Austin, TX 78741
P. K. Vasudev
Affiliation:
SEMATECH, 2706 Montopolis Drive, Austin, TX 78741
C. H. Ting
Affiliation:
AMD, One AMD Place, P.O. Box 3453, Sunnyvale, CA 94088
Get access

Abstract

Electroless Cu metallization has been fabricated by blanket electroless Cu deposition into the trenches in SiO2 dilectric layer on sputtered Cu seed layer with Ta diffusion layer and Al protection layer. Chemical-mechanical polishing of copper has been used to planarize the structure. Selective electroless CoWP layer has been deposited to protect inlaid Cu metallization.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 427: Symposium K – Advanced Metallization for Future ULSI , 1996 , 179
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Ting, C. H. and Paunovic, M., J. Electrochem. Soc., 136, 457 (1989); C. H. Ting, M. Paunovic, P. L. Pai, and G. Chiu, J. Micromech. Microeng., 1, 66 (1991).Google Scholar
2. Shacham-Diamand, Y., J. Micromech. Microeng., 1, 66 (1991).Google Scholar
3. Dubin, V. M., J. Electrochem. Soc., 139, 633 (1992).Google Scholar
4. Shacham-Diamand, Y., Dubin, V. M., Angyal, M., Thin Solid Films, 262, 93 (1995).Google Scholar