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Study of the thermal properties of polymeric dielectric materials by photothermal technique

Published online by Cambridge University Press:  10 February 2011

Chuan Hu ,
Ennis T. Ogawa ,
Michael F. Hay  and
Paul S. Ho
Chuan Hu
Affiliation:
Department of Physics, University of Texas at Austin, TX 78712
Ennis T. Ogawa
Affiliation:
Center for materials Science and Engineering, Univ. of Texas at Austin, Austin TX 78712
Michael F. Hay
Affiliation:
Center for materials Science and Engineering, Univ. of Texas at Austin, Austin TX 78712
Paul S. Ho
Affiliation:
Center for materials Science and Engineering, Univ. of Texas at Austin, Austin TX 78712
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Abstract

In this paper, we present some results of the newly developed on-wafer photothermal measurement. To study thermal anisotropy, the out-of-plane thermal diffusivity measured from this technique is compared with the in-plane thermal diffusivity by measured by ISTS [1]. In addition to the thermal properties, the agreement with mechanical [2] and optical properties are also shown. The significance of different thermal performance between low K dielectric medium materials and SiO2 suggests that greater attention should be paid to thermal properties for integrated devices with low K materials.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 511: Symposium E – Low Dielectric Constant Materials IV , 1998 , 151
Copyright
Copyright © Materials Research Society 1998

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References

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