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A Study Of The Interface Between Polyimide And Plated Copper

Published online by Cambridge University Press:  15 February 2011

Yoshiyuki Morihiro ,
Kurumi Miyake ,
Mitsumasa Mori ,
Hiroshi Kurokawa ,
Masanobu Kohara  and
Masahiro Nunoshita
Yoshiyuki Morihiro
Affiliation:
Materials & Electronic devices Laboratory, Mitsubishi Electric Corporation, 1–1, Tsukaguchi-Honmachi 8-chome, Amagasaki Hyogo, 661 Japan
Kurumi Miyake
Affiliation:
Materials & Electronic devices Laboratory, Mitsubishi Electric Corporation, 1–1, Tsukaguchi-Honmachi 8-chome, Amagasaki Hyogo, 661 Japan
Mitsumasa Mori
Affiliation:
Materials & Electronic devices Laboratory, Mitsubishi Electric Corporation, 1–1, Tsukaguchi-Honmachi 8-chome, Amagasaki Hyogo, 661 Japan
Hiroshi Kurokawa
Affiliation:
Materials & Electronic devices Laboratory, Mitsubishi Electric Corporation, 1–1, Tsukaguchi-Honmachi 8-chome, Amagasaki Hyogo, 661 Japan
Masanobu Kohara
Affiliation:
Materials & Electronic devices Laboratory, Mitsubishi Electric Corporation, 1–1, Tsukaguchi-Honmachi 8-chome, Amagasaki Hyogo, 661 Japan
Masahiro Nunoshita
Affiliation:
Materials & Electronic devices Laboratory, Mitsubishi Electric Corporation, 1–1, Tsukaguchi-Honmachi 8-chome, Amagasaki Hyogo, 661 Japan
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Abstract

A polyimide (PI) surface is analyzed by XPS at each electroless-copper-plating step. Zn ions are adsorbed on the PI surface, and subsequently replaced with Pd ions. Cu is deposited on the PI surface catalyzed by these Pd ions, As the surface concentration of Pd ions increases, the adhesive strength of the plated Cu to the PI surface increases.

In the case of PI fabrication onto a plated Cu, no significant PI degradation is observed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 227: Symposium J – Materials Science of High Temperature Polymers for Microelectronics , 1991 , 357
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

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