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Studies on the Surface Reactions of Substituted Disilanes with Silica Surface

Published online by Cambridge University Press:  01 February 2011

Tom Blomberg
Affiliation:
tom.blomberg@asm.com, ASM Microchemistry Ltd., R&D, Väinö Auerin katu 12 A, Helsinki, 00560, Finland
Raija Matero
Affiliation:
raija.matero@asm.com, ASM Microchemistry Ltd., R&D, Väinö Auerin katu 12 A, Helsinki, 00560, Finland
Suvi Haukka
Affiliation:
suvi.haukka@asm.com, ASM Microchemistry Ltd., R&D, Väinö Auerin katu 12 A, Helsinki, 00560, Finland
Andrew Root
Affiliation:
magsol@kolumbus.fi, MagSol, Tuhkanummenkuja 2, Helsinki, 00970, Finland
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Abstract

Both CVD and ALD deposition techniques benefit from a detailed understanding of the reaction mechanisms of the precursor molecules with the surface. In this paper, the reactions of hexakis ethylaminodisilane (AHEAD™), hexamethoxydisilane and hexamethyldisilane were studied on high surface area silica granules at 200-375 °C. Silica was heat treated at 200-820 °C to control the number of surface Si-OH groups. The samples were characterized by FTIR and solid state NMR spectroscopy. After the chemisorption of the precursors with silica, Si-H bonds, not originally present in the molecules, were identified for AHEAD and hexamethoxydisilane, but not for hexamethyldisilane. It is suggested that with AHEAD and hexamethoxydisilane, cleavage of the Si-Si bond takes place during the chemisorption with Si-OH sites. Since no reaction for hexamethyldisilane at the studied temperatures was observed, a prerequisite for the reaction with Si-OH groups seems to be the presence of electronegative O or N atoms in the ligands. In the paper, possible reaction mechanisms with the various surface species are discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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References

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