Hostname: page-component-5c6d5d7d68-wpx84 Total loading time: 0 Render date: 2024-08-16T03:58:44.252Z Has data issue: false hasContentIssue false
  • English
  • Français

Sol-Gel Film Formation by Dip Coating

Published online by Cambridge University Press:  28 February 2011

Alan J. Hurd  and
C. Jeffrey Brinker
Alan J. Hurd
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185–5800
C. Jeffrey Brinker
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185–5800
Get access

Abstract

The physical aspects of sol-gel film formation are discussed, including the steady state film profile during dip coating, evaporation, and capillary phenomena. It is argued that, since the evaporation rate increases singularly near a sharp boundary (analogous to an electric field singularity near a sharp conductor), the film profile near the drying line falls off precipitously, following the inverse form of the evaporation singularity. Finally, the large tensile pressures in the solvent during the final stage of drying of a porous film are discussed from the point of view of controlling the degree of capillary collapse.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 180: Symposium A – Better Ceramics Through Chemistry IV , 1990 , 575
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Schroder, H., in Physics of Thin Films: Advances in Research and Development, edited by Haas, G. and Thun, R. E., 5, 87 (1969).Google Scholar
2. Brinker, C. J., Hurd, A. J., Frye, G. C., Ward, K. J., and Ashley, C. S., in the Proceedings of the Fourth International Conference on Ultrastructure Processing of Ceramics Glasses and Composites, J. Non-Crystalline Solids, (in press, 1990).Google Scholar
3. Hurd, A. J. and Brinker, C. J., J. Phys. France 49, 1017 (1988).Google Scholar
4. Landau, L. and Levich, B., Acta Physicochim. (URSS) 17, 42 (1942).Google Scholar
5. Wilson, S. D. R., J. Engg. Math. 16, 209 (1982).Google Scholar
6. Hurd, A. J. and Brinker, C. J., in Better Ceramics Through Chemistry III, edited by Brinker, C. J., Clark, D. E., and Ulrich, D. R. (Materials Research Society, Pittsburgh) 121, 731 (1988).Google Scholar
7. Fuchs, N. A., Evaporation and Droplet Growth in Gaseous Media, (Pergamon, London, 1959) chapter 1.Google Scholar
8. Jackson, J. D., Classical Electrodynamics, (Wiley, NY, 1975) section 2.11.Google Scholar
9. Truong, J. G. and Wayner, P. C. Jr., J. Chem. Phys. 87, 4180 (1987).Google Scholar
10. Scherer, G. W., J. Non-Cryst. Solids 107, 135 (1989).Google Scholar
11. Landau, L. and Lifshitz, I., Fluid Mechanics, (Pergamon, Oxford, 1959) chapter 7.Google Scholar
12. Brinker, C. J., Hurd, A. J., and Ward, K. J., in Ultrastructure Processing of Advanced Ceramics, edited by Mackenzie, J. D. and Ulrich, D. R. (Wiley, NY, 1988) p. 233.Google Scholar
13. Burgess, C.G.V. and Everett, D. H., J. Colloid and Interface Sci. 33, 611 (1970).Google Scholar
14. Scriven, L. E., private communication (November, 1989).Google Scholar
15. Wayner, P. C., private communication (June, 1990);Google Scholar
see also Schonberg, J. and Wayner, P., AIAA Proceedings 90–1787.Google Scholar