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Scanning Conduction Microscopy: A Method of Probing Abrasion of Insulating Thin Films on Conducting Substrates

Published online by Cambridge University Press:  15 February 2011

J. T. Dickinson  and
K. W. Hipps
J. T. Dickinson
Affiliation:
Department of Physics Washington State University, Pullman, WA 99164-2814
K. W. Hipps
Affiliation:
Department of Chemistry Washington State University, Pullman, WA 99164-2814
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Abstract

The use of Scanning Force Microscopy (SFM) to probe wear processes at interfaces is of considerable interest. We present here a simple modification of the SFM which allows us to make highly spatially resolved measurements of conductivity changes produced by abrasion of thin insulating films on metal substrates. The technique is demonstrated on fluorocarbon polymer thin films deposited on stainless steel substrates.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 385: Symposium N – Polymer/Inorganic Interfaces II , 1995 , 221
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1. Dickinson, J. T., Jensen, L. C., Siek, K. H., and Hipps, K. W., to appear in Rev. Sci. Instrum. 66 (1995).Google Scholar
2. Wenzler, L. A., Han, T., Bryner, R. S., and Beebe, T. P., Rev. Sci. Instrum. 65, 85 (1994).Google Scholar
3. Anders, M., Mück, M., and Heiden, C., J. Vac. Sci. Technol. A8, 394 (1990).Google Scholar
4. Snauwaert, J., Hellemans, L., Czech, I., Clarysse, T., Vandervorst, W., and Pawlik, M., J. Vac. Sci. Technol. B12(1), 304 (1994).Google Scholar
5. Anders, M., Mueck, M., and Heiden, C., J. Vac. Sci. Technol., A 8 394(1990).Google Scholar
6. Digital Instruments, Inc., Santa Barbara, CAGoogle Scholar
7. Blanchet, Graciela B. and Shah, S. Ishmat, Appl. Phys. Lett. 62 1026 (1993).Google Scholar
8. Blanchet, G. B., Fincher, C. R. Jr., Jackson, C. L., Shah, S. I., and Gardner, K. H., Science 262, 719 (1993).Google Scholar
9. Jiang, Wenbiao, Norton, M. G., Tsung, Lancy, and Dickinson, J. T., J. Mater. Res. 10, 1038 (1995).Google Scholar
10. Lee, Sunkyo, Jensen, L. C., Langford, S. C., and Dickinson, J. T., J. Adhesion Sci. Technol. 9, 1(1995).Google Scholar
11. Scudiero, L., Dickinson, J. T., Jensen, L. C., and Langford, S. C., J. Adhesion Sci. Technol. 2, 27 (1995).Google Scholar
12. Horn, R. G. and Smith, D. T., Science 256, 362 (1992).Google Scholar
13. Dickinson, J. T., Langford, S. C., and Jensen, L. C., J. Mater. Res. 8, 2921 (1993).Google Scholar
14. Thomson, R. E. and Moreland, J., ”Development of highly conductive cantilevers for atomic force microscopy point contact measurements,” to be submitted.Google Scholar