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The Role of Process Choices in Reliability Fail Modes

Published online by Cambridge University Press:  15 February 2011

Robert M. Geffken
Robert M. Geffken*
Affiliation:
IBM Microelectronics Division, Essex Junction, VT 05452
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Extract

Projections on density, performance and cost attributes of a new technology generation are relatively easy to accomplish. However, defining the reliability attributes is more problematic, particularly if the technology contains many new process elements or tools. The choices made by a development team for processes, tools, process sequences and product-layout rules often determine the process defect reliability fail modes of a technology. These process defects define the reliability level of products rather than classic reliability fail mechanisms such as electromigration, stress migration and corrosion. As such, development teams and their reliability counterparts need to focus on potential sources of process-defect reliability fail modes and their control.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 391: Symposium T – Materials Reliability in Microelectronics V , 1995 , 37
Copyright
Copyright © Materials Research Society 1995

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