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Replication Lithography

Published online by Cambridge University Press:  21 February 2011

H. W. Deckman  and
J. H. Dunsmuir
H. W. Deckman
Affiliation:
Exxon Research and Engineering Co., Corporate Research Laboratory, Clinton Township, Route 22 East, Annandale, New Jersey 08801
J. H. Dunsmuir
Affiliation:
Exxon Research and Engineering Co., Corporate Research Laboratory, Clinton Township, Route 22 East, Annandale, New Jersey 08801
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Abstract

A new method has been developed which allows submicron patterns to be rapidly copied from a master into an inorganic substrate. Physical repli-cation and lithographic pattern transfer are combined to produce a wide variety of surface textures on large area substrates. Physical replication techniques are used to create a polymeric intermediate transfer mask which is then used as an etch mask on the substrate. Both positive and negative copies of the original pattern can be created using this process. Final pattern transfer is accomplished by dry processing, allowing precisely controlled alterations of the aspect ratios in the original pattern. Using this process it is possible to fabricate extremely large area submicron sized surface textures (such as diffraction gratings) which are useful in many areas of science and technology.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 38: Symposium F – Plasma Synthesis and Etching of Electronic Materials , 1984 , 267
Copyright
Copyright © Materials Research Society 1985

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