Hostname: page-component-76fb5796d-9pm4c Total loading time: 0 Render date: 2024-04-26T09:17:58.931Z Has data issue: false hasContentIssue false

Reduction of Toxic Gas Emissions During Gas Cabinet Manifold Vent Purge Cycles Using a Novel Scrubbing Material.

Published online by Cambridge University Press:  28 February 2011

Bruce A. Luxon
Affiliation:
Advanced Technology Materials, Inc., 520-B Danbury Rd., New Milford, CT 06776
V. R Vaughan
Affiliation:
Advanced Technology Materials, Inc., 520-B Danbury Rd., New Milford, CT 06776
J. V. Mcmanus
Affiliation:
Advanced Technology Materials, Inc., 520-B Danbury Rd., New Milford, CT 06776
G. M. Tom
Affiliation:
Advanced Technology Materials, Inc., 520-B Danbury Rd., New Milford, CT 06776
Get access

Abstract

The rapid growth of the microelectronics industry has spawned environmental problems associated with the process gases used to prepare semiconductors. Historically, many of these problems have been ignored because relatively low volumes of gases are associated with semiconductor fabrication; however, the exceptionally high toxicity of these materials (e.g. arsine, phosphine, silane, etc.) can cause major problems, especially for small quantity hazardous waste generators. Large commercial users have built expensive facilities for handling these materials, but small quantity generators typically have vented to the atmosphere through their exhaust ductwork. This is particularly true during cylinder changes where the gas manifold is repeatedly purged into the ductwork of the facility with no other treatment.

A new family of novel vent gas scrubbers that will cost-effectively reduce toxic air emissions below the Threshold Limit Value (TLV) during cylinder changes is described. Called a vent gas scrubber (VGS), this device combines high capacity, high selectivity and very high capture-effectiveness. These properties permit the VGS to be extremely compact (ca. 125 ml), last a long time in use (several years or more) and to reduce emissions to well below the TLV for improved gas handling safety.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Abe, Y. and Sugiyama, H., PPM, 16, 40 (1985).Google Scholar
2. Eiger, L. L., presented at 1986 STEP/SEMI Technical Education Programs, SLet Asnects of Effluents From CVD Process Systems, (1986).Google Scholar
3. Braker, W. and Mossman, A. in Matheson Gas Data Book, 6th ed. (Matheson, East Rutherford, NJ, 1980), p. 41.Google Scholar
4.Peter Wald, H. and Charles Becker, E., State of the Art Reviews: Occupational Medicine, 1, 105 (1986).Google Scholar
5. Flaherty, E. and Brookman, R. P., presented at 1986 STEP/SEMI Technical Education Programs, Safety Asuects of Effluents From CVD Process Systems, (1986).Google Scholar
6. Mistry, C., Ohno, Y., and Urata, T., presented at 1986 STEP/SEMI Technical vEducation Programs, Safety Aspects of Effluents From CVD Process Systems, (1986).Google Scholar
7. Ito, F., Kobayashi, M. and Abe, T., Japan Kokai Tokkyo Koho JP 61/118117 A2 [86/118117], (5 June 1986).Google Scholar
8. Sugiyama, M., Kudo, S. and Okinori, H., Japan Kokai Tokkyo Koho JP 60/238144 A2 [85/238144], (27 November 1985).Google Scholar
9. Bogdanov, V. M., Yu. Shumyatskii, I., Moiseichuk, O. V., Suchkova, Z. A., Neshumova, S. P., Fedorovskaya, V. V. and Chugunova, G. I., U.S.S.R. SU 1181692 Al, (30 September 1985).Google Scholar
10.Calgon Carbon Corporation, “Ventsorb® for industrial air purification,” Bulletin 23-56b (1986).Google Scholar
11. Haacke, G., Brinen, J. S. and Burkhard, H., J. Electrochem. Soc. 135, 715 (1988).Google Scholar