Hostname: page-component-5c6d5d7d68-wtssw Total loading time: 0 Render date: 2024-08-19T23:02:42.499Z Has data issue: false hasContentIssue false

Redistribution and Influence of Arsenic in Chromium Silicide Formation

Published online by Cambridge University Press:  26 February 2011

L. R. Zheng
Affiliation:
Department of Materials Science and Engineering Cornell University, Ithaca, NY 14853
L. S. Hung
Affiliation:
Department of Materials Science and Engineering Cornell University, Ithaca, NY 14853
J. W. Mayer
Affiliation:
Department of Materials Science and Engineering Cornell University, Ithaca, NY 14853
Get access

Abstract

The redistribution of arsenic during CrSi2 formation and its influence on the growth rate of the silicide have been investigated with Rutherford backscattering and ion channeling spectroscopy and electron microscopy. Arsenic was introduced by implantation in the metal films or in the silicon substrates. When arsenic was initially in chromium, it was incorporated in CrSi2 during silicide formation and significantly reduced the reaction rate; when arsenic was initially in silicon, it accumulated at the silicon/silicide interface with a less pronounced retarding effect than that if arsenic was present in chromium. The redistribution of dopant atoms is attributed to the fact that silicon is the dominant moving species in CrSi2 formation. The influence of dopant atoms is related to their chemical and physical state.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Wittmer, M. and Seidel, T. E., J. Appl. Phys. 49, 5827 (1978).10.1063/1.324599Google Scholar
2. Ohdomari, I., Tu, K. N., Suguro, K., Akiyama, M., Kimura, I., and Yoneda, K., Appl. Phys. Lett. 38, 1015 (1981).10.1063/1.92250Google Scholar
3. Zheng, L. R., S.Rung, L., Mayer, J. W. and Choi, K. W., Nucl. Instr. and Meth. (in press).Google Scholar
4. Wittmer, M. and Tu, K. N., Phys. Rev. B 29, 2010 (1984).10.1103/PhysRevB.29.2010Google Scholar
5. Nicolet, M.-A. and Lau, S. S., in VLSI ETlctronics; Microstructure Science, series edited by Einspruch, E. (G. Larrabee, Guest Editor, Academic, NY, 1983), Vol. 6, Chap. 6.Google Scholar
6. Zheng, L. R., Hung, L. S., and Mayer, J. W. (unpublished).Google Scholar
7. Clowolafe, J. O., Nicolet, M.-A., and Mayer, J. W., J. Appl. Phys., 47, 5182 (1976).10.1063/1.322591Google Scholar
8. Scott, D. M. and Nicolet, M.-A., Nucl. Instr. and Meth. 182/183, 655 (1981).10.1016/0029-554X(81)90792-8Google Scholar
9. Lien, C.-D. and Nicolet, M.-A., in Thin Films and Interfaces II, edited by Baglin, J.E.E., Campbell, D. R. and Chu, W. K. (Elsevier, NY 1984), p. 131.Google Scholar
10. Revesz, P., Wittmer, M., Roth, J., and Mayer, J. W., J. Appl. Phys. 49, 5199 (1978).10.1063/1.324415Google Scholar