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Recent Advances in Three Dimensional Thin Film Microbatteries

Published online by Cambridge University Press:  01 February 2011

M. Nathan
Affiliation:
Department of Physical Electronics, School of Electrical Engineering
D. Golodnitsky
Affiliation:
School of Chemistry Wolfson Applied Materials Research Center, Tel Aviv University, Tel Aviv, 69978, Israel
V. Yufit
Affiliation:
Department of Physical Electronics, School of Electrical Engineering
E. Strauss
Affiliation:
School of Chemistry
T. Ripenbein
Affiliation:
Department of Physical Electronics, School of Electrical Engineering
I. Shechtman
Affiliation:
School of Chemistry
S. Menkin
Affiliation:
School of Chemistry
E. Peled
Affiliation:
School of Chemistry
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Abstract

Autonomous MEMS require similarly miniaturized power sources. We present the first three-dimensional (3D) working thin-film microbattery (MB) technology that is compatible with MEMS requirements. Our 3D MBs are formed in perforated substrates (silicon chip or glass microchannel plate), in which a sandwich-like thin-film battery structure is deposited conformally and sequentially on all available surfaces, using wet chemistry. The area of high aspect ratio holes in the substrate enhances the capacity and energy density per given substrate footprint by more than an order of magnitude. Full 3D cells were manufactured on both glass and silicon substrates. A 3D cell on a micro-channel plate substrate exhibited a capacity of ca. 2mAh/cm2, in good agreement with the ca. 23 times area gain provided vs an identical footprint 2D cell.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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References

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