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Recent Achievement in the GaN Epitaxy on Silicon and Engineering Substrates

Published online by Cambridge University Press:  01 February 2011

Wilk Arnaud
Affiliation:
arnaud.wilk@picogiga.fr, PICOGIGA, R&D - Engineering, Villejust, France
Melania Lijadi
Affiliation:
PICOGIGA International Parc de Villejust – 91971 Courtaboeuf Cedex - France
Robert Langer
Affiliation:
PICOGIGA International Parc de Villejust – 91971 Courtaboeuf Cedex - France
Philippe Bove
Affiliation:
PICOGIGA International Parc de Villejust – 91971 Courtaboeuf Cedex - France
James Thorpe
Affiliation:
Technology Research and Development, United Monolithic Semiconductors GmbH, Wilhelm-Runge-Strasse 11, 89081 Ulm, Germany
Hervé Blanck
Affiliation:
Technology Research and Development, United Monolithic Semiconductors GmbH, Wilhelm-Runge-Strasse 11, 89081 Ulm, Germany
Virginie Hoel
Affiliation:
IEMN, institut délectronique, microélectronique et de nanotechnologies, Cité scientifique av Poincaré BP 60069, 59652 Villeneuve d'Ascq CedexFrance
Nicolas Defrance
Affiliation:
IEMN, institut délectronique, microélectronique et de nanotechnologies, Cité scientifique av Poincaré BP 60069, 59652 Villeneuve d'Ascq CedexFrance
Jean-Claude DeJaeger
Affiliation:
IEMN, institut d#x00E9;lectronique, microélectronique et de nanotechnologies, Cité scientifique av Poincaré BP 60069, 59652 Villeneuve d'Ascq CedexFrance
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Abstract

Since the middle of the 90's, GaN epitaxy techniques have been developed, using either MOCVD or MBE growth methods. A low cost approach is presented aiming at satisfying thermal issues encountered on conventional substrates such as SiC, Sapphire and more recently Silicon. Domain of application are being covered with their associated challenges: RF and High Power applications. Stress engineering is one of the key parameters.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

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References

REFERENCES

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