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Reaction of Amorphous Silicon with Cobalt and Nickel Silicides Before Disilicide Formation

Published online by Cambridge University Press:  15 February 2011

Jer-Shen Maa
Affiliation:
Sharp Microelectronics Technology, 5700 NW Pacific Rim Blvd., Camas, WA 98607
Sheng Teng Hsu
Affiliation:
Sharp Microelectronics Technology, 5700 NW Pacific Rim Blvd., Camas, WA 98607
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Abstract

A method is introduced to reduce substrate Si consumption of the salicide process by supplying extra Si from an amorphous Si film. Si is introduced into cobalt silicide and nickel silicide at the time when the silicide is converted into the disilicide phase. The reaction rate with amorphous Si is higher than that with single crystal Si if the amorphous Si has a low oxygen content.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

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References

1. Lau, S.S. and van der Weg, W.F., Thin Films. Interdiffusion and Reactions, The Electrochemical Society, Pennington, New Jersey, 1978, pp. 433480.Google Scholar
2. Lien, C.-D., Finetti, M., Nicolet, M.-A. and Lau, S.S., J. Electron. Mater.,13 (1984) 5678.Google Scholar
3. F.M.d'Heurle and Petersson, C.S., Thin Solid Films, 128 (1985) 283.Google Scholar
4. Roorda, S., Sinke, W.C., Poate, J.M., Jacobson, D.C., Dierker, S., Dennis, B.S., Eaglesham, D.J., Spaepen, F., and Fuoss, P., Physical review B, 44 (1991) 3702.Google Scholar