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Reaction between Low Dielectric Constant Fluorinated Polyimide and Aluminum

  • H. Y. Tong (a1), F. J. Szalkowski (a1), F. G. Shi (a1), B. Zhao (a2), M. Brongo (a2), S.-Q. Wang (a3) and P. K. Vasudev (a4)...

Abstract

Interactions between fluorinated polyimide and aluminum under different thermal treatment conditions have been investigated using transmission electron microscopy (TEM) and x-ray diffractometry (XRD) techniques over a wide temperature range. Our results suggest that the oxygen from the dielectric materials may result in the oxidation of the underlying aluminum either on the surface or along the grain boundary. This work implies that processing conditions, such as curing temperature and time, may play critical roles in affecting the performance of polymeric dielectric materials.

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