Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Lane, Michael
Ni, Winnie
Dauskardt, Reiner
Ma, Qing
Fujimoto, Harry
and
Krishna, Nety
1997.
Effects of Interface Nonplanarity on the Interface Fracture Energy of the TiN/SiO2System.
MRS Proceedings,
Vol. 505,
Issue. ,
Clarke, David R.
1997.
Micromechanics Measurements Applied to Integrated Circuit Microelectronics.
MRS Proceedings,
Vol. 473,
Issue. ,
Dauskardt, R.H.
Lane, M.
Ma, Q.
and
Krishna, N.
1998.
Adhesion and debonding of multi-layer thin film structures.
Engineering Fracture Mechanics,
Vol. 61,
Issue. 1,
p.
141.
Kook, S.-Y.
Snodgrass, J. M.
Kirtikar, A.
and
Dauskardt, R. H.
1998.
Adhesion and Reliability of Polymer/Inorganic Interfaces.
Journal of Electronic Packaging,
Vol. 120,
Issue. 4,
p.
328.
Miller, M.R.
and
Ho, P.S.
2000.
Interfacial adhesion study for low-k interconnects in flip-chip packages.
p.
1089.
Cui, G.
Lane, M.
Vijayamohanan, K.
and
Ramanath, G.
2001.
Interfacial Adhesion of Cu to Self-Assembled Monolayers on SiO2.
MRS Proceedings,
Vol. 695,
Issue. ,
Miller, M.R.
and
Ho, P.S.
2001.
Interfacial adhesion study for copper/SiLK interconnects in flip-chip packages.
p.
965.
Jenkins, Maura
Snodgrass, Jeffrey
Chesterman, Aaron
DeVries, Gretchen
Dauskardt, Reinhold H.
and
Bravman, John C.
2001.
Adhesion Mechanisms of Silane Adhesion Promoters in Microelectronic Packaging.
MRS Proceedings,
Vol. 682,
Issue. ,
Hsueh, C. H.
2002.
Devising a method to measure film adhesion through modeling.
Applied Physics Letters,
Vol. 81,
Issue. 9,
p.
1615.
Lane, Michael
2003.
Interface Fracture.
Annual Review of Materials Research,
Vol. 33,
Issue. 1,
p.
29.
Maex, K.
Baklanov, M. R.
Shamiryan, D.
lacopi, F.
Brongersma, S. H.
and
Yanovitskaya, Z. S.
2003.
Low dielectric constant materials for microelectronics.
Journal of Applied Physics,
Vol. 93,
Issue. 11,
p.
8793.
Maidenberg, D.
Volksen, W.
Miller, R.
and
Dauskardt, R.
2003.
Effects of templating byproducts on adhesion of nanoporous dielectric films.
p.
48.
Lee, A.S.
Lakshmanan, A.
Rajagopalan, N.
Zhenjiang Cui
Le, M.
Li Qun Xia
Bok Heon Kim
and
Hichem M'Saad
2003.
Reliability of dielectric barriers in copper damascene applications.
p.
137.
Lee, Albert S.
Lakshmanan, Annamalai
Rajagopalan, Nagarajan
Cui, Zhenjiang
Le, Maggie
Xia, Li Qun
Kim, Bok Heon
and
M'Saad, Hichem
2004.
Reliability of Dielectric Barrier Films in Copper Damascene Applications.
MRS Proceedings,
Vol. 812,
Issue. ,
Brongersma, S. H.
Degryse, Dominiek
Souiller, Jerome
Vandevelde, Bart
and
Maex, K.
2004.
Cross-Section Nano-Indentation for Rapid Adhesion Evaluation.
MRS Proceedings,
Vol. 812,
Issue. ,
Ganesan, P. G.
Cui, G.
Vijayamohanan, K.
Lane, M.
and
Ramanath, G.
2005.
Effects of amine- and pyridine-terminated molecular nanolayers on adhesion at Cu–SiO2 interfaces.
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena,
Vol. 23,
Issue. 1,
p.
327.
Gage, D.M.
Kyunghoon Kim
Litteken, C.S.
and
Dauskardt, R.H.
2005.
Effects of friction and loading parameters on four-point bend adhesion measurements of low-k thin film interconnect structures.
p.
42.
Watanabe, M.
Owada, A.
Kuroda, S.
and
Gotoh, Y.
2006.
Effect of WC size on interface fracture toughness of WC–Co HVOF sprayed coatings.
Surface and Coatings Technology,
Vol. 201,
Issue. 3-4,
p.
619.
Muñoz, M.C.
Gallego, S.
Beltrán, J.I.
and
Cerdá, J.
2006.
Adhesion at metal–ZrO2 interfaces.
Surface Science Reports,
Vol. 61,
Issue. 7,
p.
303.
Zheng, Jiantao
and
Sitaraman, Suresh K.
2007.
Fixtureless superlayer-driven delamination test for nanoscale thin-film interfaces.
Thin Solid Films,
Vol. 515,
Issue. 11,
p.
4709.