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Qualitative Model for Surface Rippling of Zone Melting Recrystallized Silicon-on-Insulator Layers

Published online by Cambridge University Press:  25 February 2011

Paul W. Mertens
Affiliation:
Interuniversity Micro-Electronics Center, Kapeldreef 75, B-3030 Leuven, Belgium
Herman E. Maes
Affiliation:
Interuniversity Micro-Electronics Center, Kapeldreef 75, B-3030 Leuven, Belgium
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Abstract

In zone melting recrystallization (ZMR) of thin silicon films different mechanisms can lead to thickness variations of the obtained silicon film. In this paper we will concentrate on some of these phenomena. One is the large scale mass transport, which typically leads to a thinned region at the start of the ZMR process. Another one, which is to a certain extent related to the first one, is the typical ripple formation that occurs especially under conditions that are commonly referred to as “low thermal gradient” regime.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

REFERENCES

1 Colinge, J.-P., technical digest of 1989 International Electron Devices Meeting, Washington D.C. December 3-6, 1989 pp.817820.Google Scholar
2 McKitterick, J.B. and Caviglia, A.L., IEEE Trans. El. Dev. 36, 1133 (1989).Google Scholar
3 Chen, C.K., Geis, M.W., Tsaur, B.-Y., Chapman, R.L. and Fan, J.C.C., J. Electrochem. Soc. 131, 1707 (1984).Google Scholar
4 Dutartre, D., in Silicon-On-Insulator and Buried Metals in Semiconductors, edited by Sturm, J.C., Chen, C.K., Pfeiffer, L. and Hemment, P.L.F. (Mater. Res. Soc. Proc. 107, Pittsburgh, PA 1988) pp. 157168.Google Scholar
5 Leamy, H.J., Chang, C.C., Baumgart, H., Lemons, R.A. and Cheng, J., Mater. Lett. 1, 33 (1982).Google Scholar
6 Pfeiffer, L., West, K.W., Joy, D.C., Gibson, J.M. and Gelman, A.E., in Semiconductor-on-Insulator and Thin Film Transistor Technology, edited by Chiang, A., Geis, M.W. and Pfeiffer, L. (Mater. Res. Soc. Proc. 53, Pittsburgh, PA 1986) pp. 29–25.Google Scholar
7 Dutartre, D., J. Appl, Phys. 66, 1388 (1989).Google Scholar
8 Glazov, V.M., Chizhevskaya, S.N. and Glagoleva, N.N., Liquid Semiconductors (Plenum Press, New York, 1969) p. 61; C.L. Yaws, R. Lutwack , L.L. Dickens and G. Hsu, Solid State Technology 1981 (Jan.), 87.Google Scholar
9 Surek, T. and Chalmers, B., J. Cryst. Growth 29, 1 (1975).Google Scholar
10 Celler, G.K. and Trimble, L.E., in Energy Beam-Solid Interactions and Transient Thermal Processing, edited by Fan, J.C.C. and Johnson, N.M. (Mater. Res. Soc. Proc. 23, New York, 1984) pp.567577.Google Scholar
11 Limanov, A.B. and Givargisov, E.I., Mater. Lett. 2, 93 (1983); J.S. Im, C.K. Chen, C.V. Thompson, M.W. Geis and H. Tomita, in Beam-Solid Interactions and Transient Processes, edited by M.O. Thompson, S.T. Picraux and J.S. Williams (Mater. Res. Soc. Proc. 74, Pittsburgh, PA 1987) pp.555–560.Google Scholar
12 Hockly, M. and Davis, J.R., in Microscopy of Semiconducting Materials, edited by Cullis, A.G. and Holt, D.B. (The Institute of Physics, Bristol U.K., 1985) p.83.Google Scholar
13 Hurle, D.T.J., in Crystal Growth, edited by Hartman, P. (North-Holland, Amsterdam, 1973), p.235.Google Scholar