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The Promotion of Metal/Polymer Adhesion by Ion Beam Enhanced Deposition

Published online by Cambridge University Press:  21 February 2011

Ih-Houng Loh ,
J. K. Hirvone ,
J. R. Martin ,
P. Revesz  and
C. Boyd
Ih-Houng Loh
Affiliation:
Spire Corporation, Bedford, MA 01730
J. K. Hirvone
Affiliation:
Spire Corporation, Bedford, MA 01730
J. R. Martin
Affiliation:
Spectrum Associates, Cambridge, MA
P. Revesz
Affiliation:
General Ionex, Newburyport, MA
C. Boyd
Affiliation:
General Ionex, Newburyport, MA
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Abstract

The adhesion between metals and polymers is normally weak because they have drastically different electronic properties and interfacial bonding between metals and organic polymers is not readily affected by conventional coating techniques. The ion beam enhanced deposition (IBED) approach to improve adhesion focuses on the promotion of non-equilibrium “interdiffusion” and the creation of nucleation sites at the interfaces by low energy ion bombardment before and during metal deposition onto the polymer substrate.

The results of our work show a significant improvement of adhesion at the metal (Au)/polymer (Teflon) interface.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 241
Copyright
Copyright © Materials Research Society 1988

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References

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