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Profiling Polyimide-Polyimide Interfaces

Published online by Cambridge University Press:  15 February 2011

Nancy C. Stoffel ,
Edward J. Kramer ,
Willi Volksen  and
Thomas P. Russell
Nancy C. Stoffel
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, NY 14850
Edward J. Kramer
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, NY 14850
Willi Volksen
Affiliation:
IBM Almaden Research, 650 Harry Rd, San Jose, CA 95120-6099
Thomas P. Russell
Affiliation:
IBM Almaden Research, 650 Harry Rd, San Jose, CA 95120-6099
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Abstract

The adhesion of spuncast polyimide layers is critical to the success of manufacturing multilayer polyimide structures. We have measured the interpenetration between a spuncast layer of the meta isomer of poly(amic ethyl ester) (PAE) precursor of PMDA 4,4′ ODA and the corresponding partially-imidized PAE base layer using forward recoil spectrometry (FRES). Measurements made with FRES show that interpenetration decreases rapidly as the base layer imide fraction f increased, with a corresponding decrease in adhesion measured with a T-peel test. In the region of f > 0.8, differences in interfacial adhesion are still observed while the interfacial widths are too narrow to be differentiated with FRES. For this reason, the use of other high resolution techniques for profiling the polyimide-polyimide interface such as nuclear reaction analysis, dynamic secondary ion mass spectrometry, and neutron reflectometry will be necessary to accurately correlate interpenetration with adhesion.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 305: Symposium I – High-Performance Polymers and Polymer Matrix Composites , 1993 , 153
Copyright
Copyright © Materials Research Society 1993

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References

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