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Preparation of Tem Plan View Sections on Specific Devices Using the Tripod Polisher

  • J. P. Benedict (a1), R. M. Anderson (a1) and S. J. Klepeis (a1)

Abstract

Plan view or “top down” sections of specific sites for TEM analysis can be prepared by mechanically polishing the specimen with the Tripod Polisher. This technique produces plan view sections with a large area available for TEM analysis that encompasses the specific site. Because the sample is mechanically polished, the problem of surface topography due to non uniform thinning is minimized.

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1. Benedict, J.P., Anderson, R.M. and Klepeis, S.J. in Advances and Applications in the Metallography and Characterization of Materials and Microelectronic Components, edited by Stevens, D. W., Clark, E. A., Zipperian, D. C. and Albrecht, E. D. (Microstructural Science Vol 23,Columbus, Ohio,1996) pp. 277284.
2. Benedict, J.P., Anderson, R.M. and Klepeis, S.J. in Specimen Preparation for Transmission Electron Microscopy of Materials - III, edited by Anderson, Ron, Tracy, Bryan and Bravman, John (Mater. Res. Soc. Proc. 254, Pittsburgh, PA 1992) pp. 121140.
3. Benedict, J.P., Anderson, R.M., Klepeis, S.J. and Chaker, M. in Specimen Preparation for Transmission Electron Microscopy of Materials - II, edited by Anderson, Ron (Mater. Res. Soc. Proc. 199, Pittsburgh, PA 1990) pp. 189204.

Preparation of Tem Plan View Sections on Specific Devices Using the Tripod Polisher

  • J. P. Benedict (a1), R. M. Anderson (a1) and S. J. Klepeis (a1)

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