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Preparation of Tem Plan View Sections on Specific Devices Using the Tripod Polisher

Published online by Cambridge University Press:  10 February 2011

J. P. Benedict ,
R. M. Anderson  and
S. J. Klepeis
J. P. Benedict
Affiliation:
IBM Corp., Hopewell Junction, NY 12533-6531
R. M. Anderson
Affiliation:
IBM Corp., Hopewell Junction, NY 12533-6531
S. J. Klepeis
Affiliation:
IBM Corp., Hopewell Junction, NY 12533-6531
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Abstract

Plan view or “top down” sections of specific sites for TEM analysis can be prepared by mechanically polishing the specimen with the Tripod Polisher. This technique produces plan view sections with a large area available for TEM analysis that encompasses the specific site. Because the sample is mechanically polished, the problem of surface topography due to non uniform thinning is minimized.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 523: Symposium U – Electron Microscopy of Semiconducting Materials & ULSI Devices , 1998 , 19
Copyright
Copyright © Materials Research Society 1998

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References

1. Benedict, J.P., Anderson, R.M. and Klepeis, S.J. in Advances and Applications in the Metallography and Characterization of Materials and Microelectronic Components, edited by Stevens, D. W., Clark, E. A., Zipperian, D. C. and Albrecht, E. D. (Microstructural Science Vol 23,Columbus, Ohio,1996) pp. 277–284.Google Scholar
2. Benedict, J.P., Anderson, R.M. and Klepeis, S.J. in Specimen Preparation for Transmission Electron Microscopy of Materials - III, edited by Anderson, Ron, Tracy, Bryan and Bravman, John (Mater. Res. Soc. Proc. 254, Pittsburgh, PA 1992) pp. 121–140.Google Scholar
3. Benedict, J.P., Anderson, R.M., Klepeis, S.J. and Chaker, M. in Specimen Preparation for Transmission Electron Microscopy of Materials - II, edited by Anderson, Ron (Mater. Res. Soc. Proc. 199, Pittsburgh, PA 1990) pp. 189–204.Google Scholar