Hostname: page-component-76fb5796d-45l2p Total loading time: 0 Render date: 2024-04-26T20:11:17.269Z Has data issue: false hasContentIssue false

Post-Deposition Sulfur Incorporation into CuInSe2 Thin Films

Published online by Cambridge University Press:  21 March 2011

Jochen Titus
Affiliation:
Institute of Energy Conversion, University of Delaware, Newark, DE 19716, U.S.A.
Hans-Werner Schock
Affiliation:
Institut für Physikalische Elektronik, Universität Stuttgart, 70569 Stuttgart, Germany
Robert W. Birkmire
Affiliation:
Institute of Energy Conversion, University of Delaware, Newark, DE 19716, U.S.A.
William N. Shafarman
Affiliation:
Institute of Energy Conversion, University of Delaware, Newark, DE 19716, U.S.A.
Udai P. Singh
Affiliation:
Institute of Energy Conversion, University of Delaware, Newark, DE 19716, U.S.A.
Get access

Abstract

The effect of initial film composition and substrate in the sulfurization of CuInSe2 was investigated. CuInSe2 films deposited on either soda-lime glass (SL) or Corning 7059® borosilicate glass (7059) substrates were reacted in flowing H2S for times from 1 to 8 hours. Films with Cu-rich composition, Cu/In > 1, reacted for 1 hour had nearly all the Se replaced by S. For Cu-poor films the incorporation of S was significantly reduced. In addition, in Cu-poor films on SL glass CuInS2 and NaInS2 were found at the film surface. These phases were not detected in films on 7059 substrates or in Cu-rich films. A phenomenological model is proposed to explain the formation of segregated surface phases in Cu-poor films on SL substrates.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Dhingra, A. and Rothwarf, A., IEEE Transactions on Electron Devices 43 (4), 613621 (1996).Google Scholar
2. Tarrant, D. and Ermer, J., Proc. 23rd I.E.E.E. PVSC, 372378 (1993).Google Scholar
3. Walter, T., Content, A., Velthaus, K. O., and Schock, H. W., Solar Energy Materials and Solar Cells 26, 357368 (1992).Google Scholar
4. Basol, B. M., Halani, A., Leidholm, C., Norsworthy, G., Kapur, V. K., Swartzlaender, A., and Matson, R., Progress in Photovoltaics: Research and Applications 8, 227235 (2000).Google Scholar
5. Nakada, T., Ohbo, H., Watanabe, T., Nakazawa, H., Matsui, M., and Kunioka, A., Solar Energy Materials and Solar Cells 49 (1-4), 285290 (1997).Google Scholar
6. Engelmann, M., McCandless, B. E., and Birkmire, R. W., Thin Solid Films 387, 1417 (2001).Google Scholar
7. Sterner, J., Matthes, T. W., Kessler, J., Lu, J., Keraenen, J., Olsson, E., and Stolt, L., Proc. 16th PVSEC, 771774 (2000).Google Scholar
8. Shafarman, W. N., Klenk, R., and McCandless, B. E., Journal of Applied Physics 79 (9), 73247328 (1996).Google Scholar
9. Villars, P., in Pearson's Handbook: Desk edition: Crystallographic Data for Intermetallic Phases (ASM International, Materials Park, Ohio, 1997), pp. 2184.Google Scholar
10. Kraus, W. and Nolze, G., PowderCell for Windows, v. 2.3 (1999).Google Scholar
11. Watanabe, T., Nakazawa, H., Matsui, M., Ohbo, H., and Nakada, T., Solar Energy Materials and Solar Cells 49 (1-4), 357363 (1997).Google Scholar