Article contents
Polyimides and Copolyimides with Low Dielectric Constant, Low Moisture Absorption, and Low Coefficient of Thermal Expansion for use as Interlayer Dielectrics
Published online by Cambridge University Press: 25 February 2011
Abstract
The mechanical, thermal, electrical and moisture absorption properties of a series of fluorinated, highly rod-like polyimides and copolyimides are reported. Copolymerization with appropriate flexibilizing comonomers resulted in improved elongations versus those of the highly rod-like homopolymers while maintaining, to a large extent,the other desirable properties of the backbone. These materials are considered prime candidates for interlayer dielectric due to their excellent combination of properties.
- Type
- Research Article
- Information
- Copyright
- Copyright © Materials Research Society 1994
References
REFERENCES
- 8
- Cited by